Blu LIFE 8, Руководство по обслуживанию

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CONTENT
DOCUMENTS INFORMATION................................................ ERROR! BOOKMARK NOT DEFINED.
1. PHRASE AND REFERENCE LITERATURE ................ ERROR! BOOKMARK NOT DEFINED.
1.1 Breviary ........................................................................................... Error! Bookmark not defined.
1.2 Phrase .............................................................................................. Error! Bookmark not defined.
1.3 Reference literature ......................................................................... Error! Bookmark not defined.
2. INTRODUCTION ................................................................................................................................ 4
2.1 Compile Objective ............................................................................................................................ 4
2.2 Project Background ........................................................................................................................... 4
3. LIFE 8 SUMMARIZE ......................................................................................................................... 5
3.1 LIFE 8 product description ............................................................................................................... 7
3.2 Assembly components on TOP layer as follow................................................................................. 8
3.3 Assembly components on Bottom layer as follow
：
........................................................................ 9
3.4 LIFE 8 Hardware Diagram .............................................................................................................. 10
4. RF PARTS .......................................................................................................................................... 12
4.1 Basic diagram: ................................................................................................................................. 12
4.2 TX Part troubleshooting ................................................................................................................. 13
4.2.1 TX process analysis .............................................................................................................. 13
4.2.2 TX circuit troubleshooting ..................................................................................................... 14
4.2.3 TX circuit examine and repair flow chart .............................................................................. 15
4.3 RX Circuit troubleshooting ............................................................................................................. 16
4.3.1 RX circuit analysis ................................................................................................................. 16
4.3.2 RF Part examine and Repair .................................................................................................. 17
4.3.3 RX examine and repair flow chart ........................................................................................ 19
5. BASEBAND PARTS .......................................................................................................................... 20
5.1 Power Management Part Diagram .................................................................................................. 20
5.2 Power on ......................................................................................................................................... 21
5.2.1 Normal Power On .................................................................................................................. 21
5.2.2 Schedule Power On/OFF ....................................................................................................... 21
5.2.3 Charge Power On ................................................................................................................... 22
5.2.4 Phone can not power on troubleshooting
：
........................................................................... 22
5.3 Audio Part troubleshooting ............................................................................................................. 22
5.3.1 Speaker Circuit ...................................................................................................................... 22
5.3.2 MIC Circuit............................................................................................................................ 22
5.3.3 Earphone Circuit .................................................................................................................... 23
5.3.4 Receiver Circuit ..................................................................................................................... 23
5.4 Vibration issue: ............................................................................................................................... 24
5.5 Download process ........................................................................................................................... 25
5.5.1 NAND Flash Download ........................................................................................................ 25
5.6 LCD Part ......................................................................................................................................... 25
5.7 CTP Part .......................................................................................................................................... 26
5.8 Camera part ..................................................................................................................................... 26
5.9 SIM card issue: ................................................................................................................................ 26