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Appendix B
Design Verification Test Procedure
B1. Purpose
This standard establishes the environmental specification for projector related products, which
defines the level of product performance and reliability in the field. It is not necessary the intent of
these specification to simulate a typical user environment, but rather to provide for a level of product
robustness that when applied over a wide range of manufacturing variability and environmental
usage conditions, which is recommended for product assurance testing reference.
B2. Test Summary
B2.1 Dynamic Test
Specification
Package Drop
Drop test with packing gross weight and falling height relationship
Gross Weight
Falling Height (cm)
spec.
( Kg )
C3/C4/C5
MP
Remark
0.0<W<4.5 >106
106
4.5
≦
W<11.0 106
91
11.0
≦
W<20.5 91
76
20.5
≦
W<34.0 76
61
34.0
≦
W<45.5 61
46
45.5
≦
W<79.4 46
31
Test Orientation: 1 corner, 3 edges, 6 Faces.
After drop test, no abnormality on function /appearance.
Package Vibration
Test condition :
1. Sine wave:
5~200Hz 1.5G, 1 octave/min, 15 min dwell on each resonant
frequency, all primary axis, one sweep 30 minutes/Min. per
orientation, total of 90+ min.
2. Random wave:
5-100Hz, 0dB/Oct. 0.015(g
2
/Hz);
100-200Hz, -6dB/Oct. N/A
200Hz, N/A 0.0038(g
2
/Hz)
Equivalent to 1.47 Grms, all primary axes, 20 min
per-orientation, total of 60 min.
Note: Perform random vibration test before, the Sine-wave
Содержание Mainstream MP611
Страница 20: ...20 Chart 1 Example of Pixel Testing Pattern 60 screen size Please contact BenQ RD for file with correct size ...
Страница 32: ...32 Figure 1 Major Blemish Two Zone Screen Non Critical Zone Critical Zone center 25 ...
Страница 43: ...43 Packing ...
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Страница 61: ...61 Disassembly Assembly Exploded View ...
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Страница 64: ...64 Disassembly Assembly ...
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Страница 68: ...68 Level 1 Cosmetic Appearance Alignment Service Appearance ...
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Страница 78: ...78 Overfill adjustment As the picture below adjust light pipe to keep overfill image center ...
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Страница 90: ...90 Figure 4 6 Figure 4 9 ...
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Страница 94: ...94 ٛ V To check and make sure CLIP of CM hook the HSG ILL very Well Fig 5 5 Fig 5 1 Fig 5 2 Fig 5 3 Fig 5 4 ...
Страница 99: ...99 BKT Link Lamp Shield CW Figure9 3 Figure9 4 ...
Страница 104: ...104 3 Example ...
Страница 105: ...105 10 Mechanical Assembly Concerns ...
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Страница 113: ...113 11 Power Assembly Concerns 1 Power board component add GP glue 1 1 CY604 CY605 add glue ...
Страница 114: ...114 1 2 CY625 CY612 add glue ...
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Страница 116: ...116 1 3 C651 R651 add glue 2 SW2 solder by operator ...
Страница 120: ...120 3 640MHZ 3 Add a Gasket on the lamp box 4 720MHZ 4 Add a Gasket on the DMD Board to Engine ...
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Страница 128: ...128 Chapter 3 Power Supply Trouble Shooting Guide 1 2 ...
Страница 142: ...142 Bridge converts the AC input into DC output and the CAP is AC filter ...
Страница 149: ...149 Circuit Schematics ...
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Страница 162: ...162 Appendix 2 Code List IR RS232 1 IR Code CUSTOMER CODE DATA CODE FUNCTION 2 RS232 command format 1 ...
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