© BECOM Systems 2020
Hardware User Manual - CM-BF527
Last change: 26. March 2019/Version 7
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9
Dependability
9.1
MTBF
Please keep in mind that a part stress analysis would be the only way to obtain significant failure rate results,
because MTBF numbers just represent a statistical approximation of how long a set of devices should last before
failure. Nevertheless, we can calculate an MTBF of the Core Module using the bill of material. We take all the
components into account. The PCB and solder connections are excluded from this estimation. For test conditions
we assume an ambient temperature of 30°C of all Core Module components except the Blackfin® processor (80°C)
and the memories (70°C). We use the MTBF Calculator from ALD (
) and use the
reliability prediction MIL-217F2 Part Stress standard. Please get in touch with BECOM Systems
(
) if you are interested in the MTBF result.
Содержание CM-BF527
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