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1-2. KEY FEATURES
High Performance Integrated MCU
•
ARM Cortex-M3 running up to 200MHz
•
1MB QSPI Flash in Package
•
512 KB on-chip SRAM; 4KB retention RAM
IO Interfaces
•
QSPI (1) SSP/SPI/I2S (3), I2C (2), UART (3)
•
USB OTG (FS) with integrated PHY
•
ADC, DAC, Analog Comparator, Temp Sensor
MCU Sub-System
•
RTC, WDT, GPT, PWM, CRC, AES (128-bit)
•
JTAG
Wireless Sub-System
•
Wi-Fi 802.11 b/g/n HT20
•
Bluetooth 4.0 (Supports Low Energy(LE))
•
Integrated Chip-Antenna
High Integration and Low-RBOM
•
Single 3.3V Power Input
Certifications
•
FCC/CE (others to be done as needed)
•
Wi-Fi & Bluetooth (via Marvell)
Package
•
LGA Module
– 18 mm x 36 mm x 2.5mm 110 pin
Antenna
• Support Chip Antenna for Internal Antenna
• Support U.FL Connector for External Antenna
• Antenna Switching for Internal/External Antenna without diversity
Содержание AW-CU277
Страница 1: ...1 AW CU277 IEEE 802 11 b g n Bluetooth 4 0 HS Smart Energy Module User manual Version 0 1...
Страница 5: ...5 1 3 FUNCTION BLOCK Block Diagram of AW CU277 Marvell Easy Connect Software...
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Страница 13: ...13 5 MECHANIC DRAWING TOP VIEW Bottom Pads Pad 0 75mm TOP VIEW...
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