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C2-2040(HS)-GigE Camera Hardware Reference Manual Rev. 1.8
Temperature Range (Operation/Storage)
Housing temperature during operation:
0 °C to +50 °C (+32 °F to +122 °F)
Sensor chip temperature (on-board) during operation:
0 °C to +65 °C (+32 °F to +149 °F)
Humidity during operation:
20 % to 80 %, relative, non-condensing
Storage temperature:
-20 °C to +80 °C (-4 °F to +176 °F)
Storage humidity:
20 % to 80 %, relative, non-condensing
Heat Dissipation
The operation of C2 sensors requires sufficient heat dissipation. Due to the small size of the camera
housing there is not enough cooling surface to dissipate the thermal power loss generated by the core
electronics and sensor chip.
All 3D sensors of the C2 series feature high-speed CMOS sensor chips. A typical property of a CMOS
sensor is that it provides best image quality by low temperatures. High temperatures will lead to an
increase of dark current, noise and hence to a reduction of signal-to-noise ratio (SNR).
To eliminate these effects it is often sufficient to mount the C2 sensor on a heat conductive material,
such as a metal surface. However if it is not possible to mount the camera on any heat dissipating
carrier, then it is necessary to use a heat sink with the recommended specification of AT.
General Guidelines for Heat Dissipation
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Mount the 3D sensor to a heat conductive material with an absolute thermal resistance
of at least 6 K / W.
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Always monitor the temperature of the sensor (on-board, available over GenICam) and make
sure that the temperature does not exceed 65 °C.
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Keep in mind that dark current and noise performance for CMOS sensor will degrade at
higher temperature.
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The 3D sensor of the C2 series will gradually become warmer during the first hour of
operation. After one hour of operation, the housing temperature as well as the sensor
temperature should be stabilized and no longer increased.
