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Revision 1.10
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AS3542 3v2
Data Sheet, Strictly Confidential - A b s o l u t e M a x i m u m R a t i n g s
Bump Temperature (soldering)
Package Body Temperature
260
°C
Norm IPC/JEDEC J-STD-020C, reflects
moisture sensitivity level only
Moisture Sensitive Level
3
1
Represents a max. floor live time of
168h
1. Depending on actual PCB layout and PCB used
Table 3. Absolute Maximum Ratings
Parameter
Min
Max
Units
Comments