2
English
1.2 Speciications
Platform
•
Micro ATX Form Factor
•
Solid Capacitor design
•
High Density Glass Fabric PCB
CPU
•
Supports 6
th
Generation Intel® Core
TM
i7/i5/i3/Pentium®/
Celeron® Processors (Socket 1151)
•
Digi Power design
•
6 Power Phase design
•
Supports Intel® Turbo Boost 2.0 Technology
Chipset
•
Intel
®
H170
•
Supports Intel® Small Business Advantage 4.0
Memory
•
Dual Channel DDR4 Memory Technology
•
4 x DDR4 DIMM Slots
•
Supports DDR4 2133 non-ECC, un-bufered memory
•
Max. capacity of system memory: 64GB
•
Supports Intel® Extreme Memory Proile (XMP) 2.0
Expansion
Slot
•
2 x PCI Express 3.0 x16 Slots (PCIE1: x16 mode; PCIE4: x4
mode)
•
2 x PCI Express 3.0 x1 Slots (Flexible PCIe)
•
Supports AMD Quad CrossFireX
TM
and CrossFireX
TM
Graphics
•
Intel® HD Graphics Built-in Visuals and the VGA outputs
can be supported only with processors which are GPU
integrated.
•
Supports Intel® HD Graphics Built-in Visuals : Intel® Quick
Sync Video with AVC, MVC (S3D) and MPEG-2 Full
HW Encode1, Intel® InTru
TM
3D, Intel® Clear Video HD
Technology, Intel® Insider
TM
, Intel® HD Graphics 510/530
•
Pixel Shader 5.0, DirectX 12
•
Max. shared memory 1792MB
•
Four graphics output options: D-Sub, DVI-D, HDMI and
DisplayPort 1.2
•
Supports Triple Monitor
•
Supports HDMI with max. resolution up to 4K x 2K
(4096x2304) @ 24Hz
Содержание Super Alloy H170M PRO4
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