6
English
1.2 Speciications
Platform
•
ATX Form Factor
•
Solid Capacitor design
CPU
•
Supports 6
th
Generation Intel® Core
TM
i7/i5/i3/Pentium®/
Celeron® Processors (Socket 1151)
•
Digi Power design
•
10 Power Phase design
•
Supports Intel® Turbo Boost 2.0 Technology
Chipset
•
Intel® H170
•
Supports Intel® Small Business Advantage 4.0
Memory
•
Dual Channel DDR4/DDR3/DDR3L Memory Technology
•
2 x DDR4 DIMM Slots
•
Supports DDR4 2133 non-ECC, un-bufered memory
•
Max. capacity of system memory: 32GB
•
Supports Intel® Extreme Memory Proile (XMP) 2.0
•
15μ Gold Contact in DDR4 DIMM Slots
•
4 x DDR3/DDR3L DIMM Slots
•
Supports DDR3/DDR3L 1866(OC)/1600/1333/1066 non-
ECC, un-bufered memory
* Supports 2 x DDR3/DDR3L memory modules up to 1866(OC)
and 4 x DDR3/DDR3L memory modules up to 1333
* Please refer to Memory Support List on ASRock's website for
more information. (http://www.asrock.com/)
•
Max. capacity of system memory: 64GB
Expansion
Slot
•
2 x PCI Express 3.0 x16 Slots (PCIE2: x16 mode; PCIE4: x4
mode)*
* Supports NVMe SSD as boot disks
•
2 x PCI Express 3.0 x1 Slots (Flexible PCIe)
•
2 x PCI Slots
* PCI cards that need subtractive decode are not supported.
•
Supports AMD Quad CrossFireX
TM
and CrossFireX
TM
Содержание H170 Combo
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Страница 112: ...110 1 3 3 1 2 CMOS CLRMOS1 p 1 No 20 CLRMOS1 CMOS 15 CLRCMOS1 2 3 5 BIOS CMOS BIOS CMOS CMOS CMOS CMOS...
Страница 122: ...120 1 3 3 1 2 CMOS CLRMOS1 1 20 CLRMOS1 CMOS 15 CLRMOS1 2 3 5 BIOS CMOS BIOS CMOS CMOS CMOS CMOS...
