S9k S9SE Maintenance Guide
1
Instructions for S9K S9SE Maintenance
Editor-in-Chief:
Wang Penghua
Version date:
2019.7.9
File Category:
Maintenance Plan
Content of this Volume:
It mainly describes the troubleshooting of various faults of S9K S9SE, and how to use the test tool for accurate positioning.
I. Requirements on the Maintenance Platform
1. The constant temperature soldering iron (350-400°C). The tip soldering iron head is used for soldering chip resistors and capacitors.
2. The thermal chimney is used for chip disassembly and soldering, be careful not to heat for a long time to avoid PCB foaming.
3. APW3 + + power supply (output
12V, 133A Max
), used for test and measurement of the computing board.
4. The multimeter, tweezers,
V9
test jig (if there is condition, an oscilloscope can be configured).
5. Flux, water for cleaning panel with anhydrous alcohol; water for cleaning panel is used to clean flux residue and appearance after maintenance.
7. Thermally conductive adhesive is used to re-attach the cooling fin after repair.
II. Requirements on Maintenance Operations
1. The maintenance personnel must have certain electronic knowledge, more than one year of maintenance experience, and master QFN package welding
technology.
2. After repair, the computing board must be tested twice and confirmed as OK before it can pass!
3. Pay attention to the operation method when replacing the chip. After replacing any accessories, the PCB board is not obviously deformed, and the replaced
parts and the surrounding area shall be checked for whether there is open and short circuit.
4. Determine the maintenance station object and the corresponding test software parameters and test jigs.
5. Check whether the tools and jigs can work normally.
(Whether the power output is the same as the setting in the jig config file. Different BIN level and chip package mode need to correspond to the config and
single-board-test files of the single board test jig program.)
III. Principle and Structure
1. Principle overview
1. S9K S9SE computing board
is composed of 6 voltage domains connected in series. There are
10 BM1393
chips in each voltage domain, and there are
60
BM1393
chips on the whole board.
2.
There are 208 cores on a single
BM1393
chip, the domain voltage is 1.6V, and the total voltage of the 6 domains on the whole board is 9.6V-9.9V
3. S9K S9SE clock is composed of two 25M active crystal oscillators (Y1, Y2), Y1 is transmitted from the first chip to the 30th chip in series, and Y2
is transmitted from the 31st chip to the 60th chip in series
4.
There is independent small cooling fin on the front and back of each chip of the
S9K S9SE computing board.
The small cooling fin on the front side is the
SMT patch, and the small cooling fin on the back side is fixed on the back of the IC by the thermally conductive adhesive after the initial measurement. After
the repaired and replaced chip passes the test, it is necessary to evenly apply black thermally conductive adhesive on the IC surface and heat and fix it.
Note:
In the maintenance process, when replacing the circuit board components or the chip, in order to reduce the damage of high temperature of the blower gun to
the PCB board and the chip, it is necessary to first remove the small cooling fins near the faulty component and on the back of the PCB board before
replacing.
There are test points on the PCB chip surfaces. When manufacturing and repairing, if there is no cooling fin attached on the PCB chip, the test point on the
chip surface can be used; for repair of finished products (after-sales repair), since the front and back of the PCB are covered by cooling fins, it needs to locate
fault through the test point on the chip surface of the PCB. A special slender test lead can be used to probe the cooling fin gap for measurement. However,
since the SMT small cooling fin is connected to the ground of each voltage domain, it is necessary to pay attention to the insulation of the test lead in
measurement to avoid short circuit caused by the test lead.
