
Rev A
33
4. TROUBLESHOOTING AND REPAIR
4.1 GENERAL MAINTENANCE INFORMATION
Because it is a relatively simple instrument, the Model 1000W1000G should require very little
maintenance. It is built with solid state devices and printed wiring boards (PWBs) that should ensure
long, trouble-free life. Should trouble occur, special care must be taken when servicing the unit to avoid
damaging the solid state devices and PWB’s.
Since the amplifier’s components are soldered in place, substitution of components should not be resorted
to unless there is some indication that they are faulty. In addition, care must be taken not to short
voltages across the amplifier when troubleshooting, because small bias changes may damage the amplifier
due to excessive dissipation or transients.
Components used in AR RF/Microwave Instrumentation instruments are conservatively operated to
provide maximum instrument reliability. In spite of this, parts may fail. Usually, the instrument must be
immediately repaired with a minimum of down time. A systematic approach can greatly simplify and
thereby speed up repairs. The Model 1000W1000G incorporates fault control and detection circuits,
including display panel indications that can expedite troubleshooting of the unit. For a description of how
these indications can be used to assist in troubleshooting the unit, please see Section 4.3,
Fault Signal
Interpretation and Diagnosis.
Shipping instructions are as follows. To return an item, contact AR Customer Service for an RMA
number and shipping instructions. Returns from outside the United States are not permitted without prior
authorization. If shipping from outside of the United States, closely follow all directions on the RMA
form for return shipping and marking. See warranty statement at rear of manual.
4.2 DISASSEMBLY PROCEDURE
CAUTION:
Extreme caution should be exercised when troubleshooting this unit,
particularly when measuring voltages in the power supply section of the
unit. Hazardous voltages do exist in the unit that could cause serious
injury to any personnel performing the measurements.
The enclosure and amplifier top cover can be removed to gain access to the low level and driver RF
assemblies along with remote interfaces. The enclosure and amplifier side panels can be removed to gain
access to final module and power supplies. The power combiner can be accessed through the front and
rear access panels
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