ADAV4622
Rev. B | Page 12 of
28
ABSOLUTE MAXIMUM RATINGS
Table 3.
Parameter Rating
DVDD to DGND
0 V to 2.2 V
ODVDD to DGND
0 V to 4 V
AVDD to AGND
0 V to 4 V
AGND to DGND
−0.3 V to +0.3 V
Digital Inputs
DGND − 0.3 V to ODVDD + 0.3 V
Analog Inputs
AGND − 0.3 V to AVDD + 0.3 V
Reference Voltage
Indefinite short circuit to ground
Soldering (10 sec)
300°C
Stresses above those listed under Absolute Maximum Ratings
may cause permanent damage to the device. This is a stress
rating only; functional operation of the device at these or any
other conditions above those indicated in the operational
section of this specification is not implied. Exposure to absolute
maximum rating conditions for extended periods may affect
device reliability.
THERMAL RESISTANCE
θ
JA
is specified for the worst-case conditions, that is, a device
soldered in a circuit board for surface-mount packages.
Table 4. Thermal Resistance
Package Type
θ
JA
θ
JC
Unit
80-Lead LQFP
38.1
7.6
°C/W
1
Based on JEDEC 2S2P PCB.
THERMAL CONDITIONS
To ensure correct operation of the device, the case temperature
(T
CASE
) must be kept below 121°C to keep the junction tempera-
ture (T
J
) below the maximum allowed, 125°C.
ESD CAUTION