AD9273
Rev. B | Page 44 of 48
OUTLINE DIMENSIONS
COMPLIANT TO JEDEC STANDARDS MS-026-AED-HD
1
25
26
50
76
100
75
51
14.00 BSC SQ
16.00 BSC SQ
0.75
0.60
0.45
1.20
MAX
1.05
1.00
0.95
0.20
0.09
0.08 MAX
COPLANARITY
VIEW A
ROTATED 90
°
CCW
SEATING
PLANE
0° MIN
7°
3.5°
0°
0.15
0.05
VIEW A
PIN 1
TOP VIEW
(PINS DOWN)
0.27
0.22
0.17
0.50 BSC
LEAD PITCH
1
25
26
50
76
100
75
51
BOTTOM VIEW
(PINS UP)
9.50 SQ
EXPOSED
PAD
10
09
08
-A
FOR PROPER CONNECTION OF
THE EXPOSED PAD, REFER TO
THE PIN CONFIGURATION AND
FUNCTION DESCRIPTIONS
SECTION OF THIS DATA SHEET.
Figure 71. 100-Lead Thin Quad Flat Package, Exposed Pad [TQFP_EP]
(SV-100-3)
Dimensions shown in millimeters
COMPLIANT WITH JEDEC STANDARDS MO-205-AC.
SEATING
PLANE
0.43 MAX
0.25 MIN
DETAIL A
0.55
0.50
0.45
BALL DIAMETER
COPLANARITY
0.12 MAX
0.80 BSC
8.80
BSC SQ
A
B
C
D
E
F
G
J
H
K
L
M
12
11
10
8
7
6
3
2
1
9
5
4
1.00
0.85
A1 CORNER
INDEX AREA
1.40 MAX
TOP VIEW
BALL A1
INDICATOR
DETAIL A
BOTTOM VIEW
10.10
10.00
9.90
012
006-
0
Figure 72. 144-Ball Chip Scale Package, Ball Grid Array [CSP_BGA]
(BC-144-1)
Dimensions shown in millimeters
Содержание AD9273
Страница 47: ...AD9273 Rev B Page 46 of 48 NOTES...
Страница 48: ...AD9273 Rev B Page 47 of 48 NOTES...