AMD CrossFire 480X Скачать руководство пользователя

Страница: 6 / 16

AMD CrossFire Chipset

Logos and Text Treatment

AMD should be in full caps. All AMD Chipset and product feature names should

be spelled out in lower case with the first letter capitalized. Do not spell the

entire product or product feature name in capital letters only. For ‘CrossFire’,

‘C’ and ‘F’ are in capital letters and should be followed by “TM”.

Correct Examples

Incorrect Examples

AMD 580X CrossFire™ Chipset

AMD 480X CROSSFIRE™ Chipset

AMD 580X CrossFire™ Chipset

Amd 480X Crossfire™ Chipset

AMD 580X CrossFire™ Chipset

AMD 480X CrossFire Chipset

Note: ASIC variant name (i.e R580) is NOT to be used at anytime.

Содержание CrossFire 480X

Страница 1: ...AMD CrossFire Series Chipset Packaging and Branding Guidelines...

Страница 2: ...anded AMD CrossFire Series chipset products By using these guidelines you will generate greater interest in your products and affinity with your audiences The following pages offer resources and guide...

Страница 3: ...o the AMD CrossFire Series Chipset The list below summarizes the CrossFire Chipset product offering for the AMD platform BRAND NAMES ASIC Variant Platform Chipset RD480 DT AMD 480X RD550 DT AMD 550X R...

Страница 4: ...AMD CrossFire Chipset 4 Logos and Text Treatment Section 1...

Страница 5: ...c elements in your packaging you create immediate awareness and connection with your audience This guide outlines the proper usage of all AMD Chipset logos All logos must be used as is and cannot be a...

Страница 6: ...the entire product or product feature name in capital letters only For CrossFire C and F are in capital letters and should be followed by TM Correct Examples Incorrect Examples AMD 580X CrossFire Chi...

Страница 7: ...y featured greater than 2X text size on the packaging For all packaging copy the applicable trademark notice must be used beside the first instance of use of all product and product feature names used...

Страница 8: ...ipset logos when promoting motherboards or systems with these chipset The logos must be used in the following applications On the heat sink for Northbridge Logo on the Southbridge is optional On the P...

Страница 9: ...dge on the Motherboard heat sink These logos are used on the PC boot up Screen BIOS Splash for motherboard packaging see packaging guidelines for more details advertisement collateral material etc Fil...

Страница 10: ...Screen Logo The BIOS Splash screen logo must be placed either in the center of the monitor or the upper top left hand corner of the screen The logo must be no smaller than 2 inches in width length to...

Страница 11: ...AMD CrossFire Chipset 11 Packaging Guidelines Section 2...

Страница 12: ...been developed to provide consistent brand recognition for the logo established for all AMD products and to more clearly communicate the consumer benefits of AMD products Please follow these guidelin...

Страница 13: ...ndatory element for all partner packaging The AMD CrossFire Chipset product logo MUST be on the front and back panels of the retail box This elements must be reproduced without variation in the positi...

Страница 14: ...t always appear at least once 4 Pantone color 347 is always used for AMD green Pantone color 185 is always used for CrossFire red 5 Partners must include the following standard legal line on all packa...

Страница 15: ...AMD CrossFire Chipset 15 Packaging Guidelines Logo Sizing Requirements 1 Logo must be 0 375 away from box edge and other logos 2 The logo must be at least 2 wide 2 0 375...

Страница 16: ...t placed on the front top side of the packaging 2 The badge is two small not meeting the 2 wide criteria 3 Partners may not add unauthorized numeric or alphabetical extensions after the Chipset techno...