-21-
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
26
27
28
29
30
Pin No.
Pin Name
I/O
Description
FIN1
FIN2
TIN1
TIN2
REF1
VREF
LDS
LDD
GND
LDOF
ODRV
AGON
EFBL
TESO
TESI
TES
HFL
TE
TE-
FE
FE-
RFEV
NC
BH
PH
NC
RF
RF-
RFSW
VCC
Pick-up signal input.
Pin designed for reference voltage.
Reference voltage output.
APC monitor voltage input.
APC output.
GND.
Laser OFF pin. (H: ON L: OFF)
Speed switch pin. (H: double L: normal speed)
AGC ON pin. (H: ON L: OFF)
FE balance adjustment pin.
TE signal output for TES. (Not connected)
TE input for TES formation. (Not connected)
TES output. (Not connected)
HFL signal output.
TE signal output.
Minus input for TE gain design.
FE signal output.
Minus input for FE gain design.
RF envelop signal output.
Pin N/C. (Not connected)
Capasitance connection pin for RF bottom clamp.
Capasitance connection pin for RF gain design.
Pin N/C. (Not connected)
RF signal output.
Minus input for RF signal gain design.
Switch for equalizer design when RF has double speed.
Power supply.
I
I
I
I
I
O
I
O
—
I
I
I
I
O
I
O
O
O
I
O
I
O
—
I
I
—
O
I
I
—
IC DESCRIPTION-3/3 (LA9235M)-1/1
Содержание XP-V320
Страница 8: ...8 FL AHC 7 GRID ASSIGNMENT ANODE CONNECTION 1 1 GRID ASSIGNMENT ANODE CONNECTION...
Страница 10: ...10 SCHEMATIC DIAGRAM 1 1 16P H Toc A 6P 2HV...
Страница 11: ...11 IC101 IC201 Q305 TEST MODE SHORT LAND RF VC IC301 IC351 IC801 27 IC701 31 TEST MODE 1 3...
Страница 27: ...27 CD MECHANISM EXPLODED VIEW 1 1 DA23L 2 4 5 9 3 1 8 7 10 D D A C B 6...
Страница 30: ...2 11 IKENOHATA 1 CHOME TAITO KU TOKYO 110 8710 JAPAN TEL 03 3827 3111 H251701 Printed in Singapore...