Advantech MIO-2375, Руководство пользователя

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MIO-2375 User Manual 6
2.1 Introduction
This MI/O compact form factor, next-generation SBC features a variety of mechanical
improvements. The following is a quick installation guide for Advantech’s thermal
solution.
This chapter comprises assembly instructions for standard and optional thermal solu
-
tions as well as board dimension diagrams.
2.2 Board Layout: Dimensions
Figure 2.1 MIO-2375 Mechanical Diagram (Top Side)
0
3.25
50
96.75
100
0
3.25
36
68.75
72