6
Product Overview
Table 1-7 provides shock and vibration tests performed on the board.
Table 1-8 presents the average times between system failures.
1.6.6
Thermal/Cooling Requirements
The CM1-86DX3 is designed to operate at its maximum CPU speed and requires a thermal
solution to cool the CPU. ADLINK offers a heat spreader and a passive heatsink (separate order
numbers) for cooling. The heatsink can be used for module evaluation. If a custom heatsink is
used, it is recommended to connect it to the ADLINK heat spreader. This facilitates future mod-
ule upgrades without the need to re-design the custom heatsink. Refer to Figure 1-3 for heatsink
dimension and mounting information. See Figures 1-4 and 1-5 for airflow requirements.
Table 1-7: Shock and Vibration
Parameter
Result
Shock Test
MIL-STD-202F, Method 213B, Table 213-I, Condition A
Random Vibration Test
MIL-STD-202F, Method 214A, Table 214-I, Condition D
Table 1-8: Mean Time Between Failures
Parameter
Value
MTBF at 25°C
200,000 hrs (according to Bellcore calculation)
12.05 [0.474]
6.25 [0.246]
3 [0.118]
12.05 [0.474]
9.82 [0.387]
32.82 [1.292]
0.52 [0.02]
0.52 [0.02]
3.02 [0.119]
31.52 [1.241]
47.52 [1.871]
78.52 [3.091]
21.42 [0.843]
74.92 [2.95]
2 [0.079]
Pitch:4 [0.157]
2 [0.079]
Pitch:4.1 [0.161]
79.02 [3.111]
81.52 [3.209]
27.72 [1.091]
72.42 [2.851]
14.22 [0.56]
10.12 [0.398]
37.52 [1.477]
44.92 [1.769]
74.42 [2.93]
78.62 [3.095]
68.92 [2.713]
5.12 [0.202]
CM1-86DSX_heatsink_mnt_dmn_a
Содержание CM1-86DX3
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