AP513 ACROPACK
USER
’S MANUAL
Acromag, Inc. Tel: 248-295-0310
- 10 -
http://www.acromag.com
- 10 -
www.acromag.com
2.2 Installation Considerations
IMPORTANT: Adequate air
circulation must be provided to
prevent a temperature rise
above the maximum operating
temperature.
Refer to the specifications section for loading and power requirements. Be
sure that the system power supplies are able to accommodate the power
requirements of the system boards, plus the installed Acromag board,
within the voltage tolerances specified.
In an air cooled assembly, adequate air circulation must be provided to
prevent a temperature rise above the maximum operating temperature and
to prolong the life of the electronics. If the installation is in an industrial
environment and the board is exposed to environmental air, careful
consideration should be given to air-filtering.
In a conduction cooled assembly, adequate thermal conduction must be
provided to prevent a temperature rise above the maximum operating
temperature.
2.3 Board Configuration
Power should be removed from the board when installing AP modules,
cables, termination panels, and field wiring. The AP513 Isolated RS232
communication board has no hardware jumpers or switches to configure.
2.4 Field I/O Connector
A field I/O interface connector provides a mating interface between the AP
modules and the carrier board. The 100 pin ST5-50-1.50-L-D-P-TR Samtec
connector is used on the AcroPack module as board to board interconnect.
This connector will mate with the 100 pin SS5-50-3.00-L-D-K-TR Samtec
connector on the carrier. The stack height is 4.5mm.
Threaded metric M2.5 screws and spacers are supplied with the AcroPack
carriers to provide additional stability for harsh environments.
lists signal pin assignments for the 100-pin module/carrier field I/O
connectors, as well as the 50-pin/68-pin CHAMP and ribbon I/O connectors
on the carrier.