40
18
Disassemble the
screw*4(M3*7.5L),
and take off the
HSINK and DMD chip
with Chip BD.
screw
driver
19
(1)Disassemble the
baffle DMD.
(2)Disassemble the
screw*3(M3*4L) and
take off the CW
module.
screw
driver
20
Rotate to open the
switch on socket, and
take off the DMD
chip.
screw
driver
21
(1)Disassemble ILL
module screw*2
(M2.5*5L).
(2)Take off
screw*1(M2*8L), FM
holder, fold mirror, FM
clip*2, clip CM front,
clip CM side and
sponge.
screw
driver
22
(1)Disassembly the
screw*1(M2*3L).
(2)Take off the LP
module and LP
screw*2(M2*8L).
screw
driver
1
2
3
4
3
screw*1
1
2
sponge
screw*1
1
2
1
2
CW module
baffle DMD
L/P
Note:
Circuit boards > 10cm
2
has been highlighted with the yellow
rectangle as above image shows. Please detach the Circuit boards and
follow local regulations for disposal.
Содержание X1130P Series
Страница 16: ...16 System Block Diagram ...
Страница 17: ...17 Product Overview ...
Страница 18: ...18 ...
Страница 19: ...19 ...
Страница 20: ...20 ...
Страница 42: ...42 Fig 1 3 Fig 1 4 1 Press down the Clip 2 Insert the LP Module Overfill adjustment screws LP Datum of DMD HSG ...
Страница 45: ...45 Fig 3 3 Fig 3 4 Fig 3 5 Fig 3 6 Datum1 Datum2 Datum3 Clip UP CM Sponge ...
Страница 58: ...58 ...
Страница 61: ...61 Confirm the position of EMI cord right Screw Screw ...
Страница 64: ...64 12 Front IR wire to MB alignment Front IR wire should align in to these grooves ...
Страница 74: ...74 Power Supply Problems Checking Flow ...
Страница 84: ...84 Chapter 5 FRU List Exploded Diagram Module 1 Total Exploded View ...
Страница 85: ...85 ...
Страница 86: ...86 Module 2 ASSY UPPER CASE ...
Страница 87: ...87 Module 3 ASSY LOWER CASE ...
Страница 88: ...88 Module 4 ASSY FRONT CASE ...
Страница 95: ...95 X1130PA X1230PK X1230P X1230PA X1237 Customer code 0813 ...