49
Fig. 5-3 Fig. 5-4
5.4 Place Damper on the surface of Chip-BD Fig. 5-5.
.
Fig. 5-5
6. Assembly OP ENG
6.1 Assemble “Baffle DMD” to “HSG DMD” (Fig 6-1).
6.2 Assemble “Sponge DMD” to “HSG DMD” (Fig 6-2).
6.3 Assemble Chip B/D Module to “HSG DMD” (Fig. 6-
3、
Fig. 6-4).
Fig. 6-1 Fig.6-2
Damper
Button
Open notation
Close notation
Alignment keying
Baffle DMD
Sponge
DMD
Sponge DMD
Содержание S5201M Series
Страница 17: ...17 System Block Diagram ...
Страница 18: ...18 Product Overview ...
Страница 19: ...19 ...
Страница 20: ...20 ...
Страница 21: ...21 ...
Страница 47: ...47 Fig 3 4 Fig 3 5 Fig 3 6 Fig 3 7 Fig 3 8 Clip UP CM Sponge AL Screw MYLAR CM ...
Страница 59: ...59 Inlet Case Module Fan FAN60 60 13 fan wire direction Outlet Case Module ...
Страница 68: ...68 Attach mylar on UC align this edge First Second M3 screw ...
Страница 70: ...70 9 Overall wire review Notice lamp wire dressing ...
Страница 87: ...87 Chapter 5 FRU List Exploded Diagram Module 1 Total Exploded View ...
Страница 88: ...88 ...
Страница 89: ...89 Module 2 ASSY UPPER CASE ...
Страница 90: ...90 Module 3 ASSY LOWER CASE ...
Страница 91: ...91 Module 4 ASSY FRONT CASE ...