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230
Appendix B
Microsoft
®
Windows
®
7 Environment Test
Vendor
Type
Description
PN
CPU
Intel
Arrandale 2.13G
(Ci3330M)
IC CP80617004122AG SLBMD C2 2.13G
PGA988
Intel
Arrandale 2.26G
(Ci3350M)
IC CP80617004161AC SLBPK C2 2.26G
PGA988
Intel
Arrandale 2.26G
(Ci5430M)
IC CP80617004161AD SLBPN C2 2.26G
PGA988
Intel
Arrandale 2.4G
(Ci5520M)
IC CP80617004119AE SLBNB C2 2.4G
PGA988P
Intel
Arrandale 2.53G
(Ci5540M)
IC CP80617004116AD SLBPG C2 2.53G
PGA988
Intel
Arrandale 2.66G
(Ci7620M)
IC CP80617003981AH SLBPD C2 2.66G
PGA 988P
Intel
Q3GG C2 2.13G
CPU Intel Core i3 330M PGA 2.13G 35W
Arrandale, TJ90, VT, 3M L3
Intel
Q3LN C2 2.26G
CPU Intel Core i3 350M PGA 2.26G 35W
Arrandale, TJ90, VT, 3M L3
Intel
Q3LR C2 2.26G
CPU Intel Core i5 430M PGA 2.26G ARD,
uP to SC 2.53G, 3M L3
RAM SODIMM DDR3-1G 1066
SAMSUNG
1G DDR3-1066
DDR3 MODU SAM M471B2873EH1-CF8
1GB/1066
ELDIPA
1G DDR3-1066
DDR3 MODU SAM EBJ11UE6BDS0-AE-F
1GB/1066
HYNIX
1G DDR3-1066
DDR3 MODU HYN HMT112S6BFR6C-
G7N0 1G/1066
RAM SODIMM DDR3-2G 1066
MICRON
2G DDR3-1066
MT16JSF25664HZ-1G1F1
SAMSUNG
2G DDR3-1066
DDR3 MODU SAM M471B5673EH1-CF8
2G/1066
ELDIPA
2G DDR3-1066
DDR3 MODU ELP EBJ21UE8BDS0-AE-F
2G/1066
HYNIX
2G DDR3-1066
DDR3 MODU HYN HMT125S6BFR8C-
G7N0 2G/1066
RAM SODIMM DDR3-4G 1066
SAMSUNG
4G DDR3-1066
M471B5273BH1-CF8
ELPIDA
4G DDR3-1066
Memory NONE SO-DIMM DDRIII 1066 4GB
dummy P/N LF
RAM SODIMM DDR3-1G 1333
SAMSUNG
1G DDR3-1333
M471B2873FHS-CH9
RAM
SODIMM
DDR3-2G
1333
SAMSUNG
2G DDR3-1333
M471B5673FH0-CH9 LF
RAM SODIMM DDR3-4G 1333
SAMSUNG
4G DDR3-1333
M471B5273CH0-CH9
Содержание Aspire 5741
Страница 6: ...VI ...
Страница 10: ...X Table of Contents ...
Страница 15: ...Chapter 1 5 System Block Diagram ...
Страница 48: ...38 Chapter 2 ...
Страница 68: ...58 Chapter 3 3 Turn the computer over and disconnect the following four 4 cables from the Mainboard A B C D ...
Страница 72: ...62 Chapter 3 5 Lift the Speaker clear of the Upper Cover ...
Страница 74: ...64 Chapter 3 5 Lift the Right Speaker Module clear of the device ...
Страница 86: ...76 Chapter 3 4 Carefully lift the Thermal Module clear of the Mainboard ...
Страница 95: ...Chapter 3 85 5 Lift the LCD Panel clear of the module ...
Страница 98: ...88 Chapter 3 7 Disconnect the LVDS cable from the panel ...
Страница 100: ...90 Chapter 3 5 Lift the microphone set clear of the panel ...
Страница 109: ...Chapter 3 99 Replacing the Camera Module 1 Place the Camera in the module 2 Connect the camera cable ...
Страница 118: ...108 Chapter 3 6 Connect the LVDS cable and lock the connector 7 Connect the microphone cable ...
Страница 123: ...Chapter 3 113 4 Replace the FFC and press down as indicated to secure it to the Upper Cover ...
Страница 128: ...118 Chapter 3 3 Connect the following cables to the Mainboard 4 Connect D as shown 5 Connect C as shown A B C D ...
Страница 169: ...Chapter 6 159 10 LCD Cover 60 PSV02 003 No Description Acer P N ...
Страница 179: ...Chapter 6 169 ...
Страница 180: ...Appendix A 170 Model Definition and Configuration Appendix A ...
Страница 252: ...242 Appendix B ...
Страница 254: ...244 Appendix C ...
Страница 258: ...248 ...