Hardware Development Guide of Module Product
All Rights reserved, No Spreading abroad without Permission of ZTEWelink
III
Revision History
Version
Date
Description
1.0
2010-04-15
1
st
version
2.0
2013-03-20
1. Delete the part of 3.13 and 3.14 in former version
2. Change Logo of the header, footer and front cover
3. Modify the legal information
2013-05-13
4. Modify the Reference document list in chapter 1.3
5. Add the module dimensions of top plane and thickness
6. Modify the chapter 7.7 of Recommended Product
Upgrading Plan
7. Modify the Standby current from 3.5mA to 5mA in Table
2-1
8. Modify the peak current from ≤470mA to ≤2A and
modify the Working temperature from 70 to 75°C in
Table 2-1
9. Modify the Pin 32-35,64,65,67,68 and description in
chapter 3.1.3
10. Modify chapter 3.8.3 to support of 8 wire UART
11. Modify the MODULE_WAKEUP_AP interface
application
12. Modify the product test environment in Table 6-2 and
6-4
13. Modify the product test result in Table 6-6
14. Update the Figure 3-1 of PIN Configuration Diagram
Modify the Figure 7-2 of Main and AGPS Antenna
Welding Pad Interface
15. Modify the Figure 7-1 of Main Antenna RF Connector
Interface
16. Modify Figure 2-1 of Product Illustration
2013-05-31
17. Release as Version 2.0
