Hardware Development Guide of Module Product
6
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Table 2-1 Major Technical Parameters
Name
Parameter
Item
Specifications
Mechanical
Feature
Dimensions
36mm * 26mm * (2.5+/-0.2)mm
Weight
About 5.2g
Encapsulation
type
LGA package(108 Pin)
Baseband
Processor
architecture
ARM 9 architecture
(U)SIM/SIM
Standard 6 PIN SIM card interface
3V SIM card and 1.8V SIM card
Memory
32MByte/128MByte
USB interface USB 2.0 HIGH SPEED
Maximum
power
consumption
1
2.2W
Voltage
DC 3. 4V-4.2V, typical: 3.8V
Working
current
2
Peak current
≤2A (3.8V)
note1
Average normal working current
≤150mA (3.8V)
note2
Average normal working current
(without services)
≤75mA
Standby current
≤5mA (3.8V)
note3
RF
GSM band
EDGE/GPRS/GSM: 1900/1800/900/850MHz
UMTS band
/WCDMA: 2100/1900/850(900)MHz;
RxDiv Band
NA
note
4
Max.
transmitter
power
UMTS2100/1900/850(900): Power Class 3 (+24dB +1/-3dBm)
GSM/GPRS 850MHz/900MHz: Power Class 4 (+33dBm
±2dBm)
GSM/GPRS 1800MHz/1900MHz: Power Class 1 (+30dBm
±2dBm)
EDGE 850MHz/900MHz: Power Class E2 (+27dBm ±3dBm)
EDGE 1800MHz/1900MHz: Power Class E2 (+26dBm
-4/+3dBm)
Receiving
sensitivity
WCDMA2100 : ≤-106.7dBm
WCDMA1900/850 : ≤-104.7dBm
WCDMA900 : ≤-103.7dBm
