Zenith Z-170, Owner'S Manual

Page: 76 / 147

A.6
Appendix A
256K Dynamic
RAM
Chips Installation
CAUTION:
Many integrated circuits (!Cs) are electrostatic-sensitive and
can be damaged by static electricity. Observe the following precautions
when handling I Cs.
• Once you remove an I C or a circuit board from its protective foam
packing, envelope, or computer,
do not
lay the IC or board down
or let go of it until you install it in your computer.
•
It may be necessary to straighten the
pins on an IC so they line up with the
holes in an IC socket. When you bend
the leads of an I C, hold the IC in one
hand and place your other hand on
your work surface before you touch the
I C to the work surface. This equalizes
the static electricity between the work
surface and the !C. To straighten the
pins, lay the IC down on its side and
very carefully roll it toward the pins
to bend the lower pins into line. Then
turn the IC over and bend the pins
on the other side.
The 256K dynamic RAM chips (Z-205-4) are installed in complete banks
(rows of !Cs). Install the 256K dynamic RAM chips upgrade in bank C.
(Additional upgrades are installed in bank D, then E.)
To install a bank of !Cs:
Remove the back cover from the computer. (See "General Disassem­
bly.")
Remove the memory board by gently pulling straight up.