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ESD PRECAUTIONS

Electrostatically Sensitive Devices (ESD)

Some semiconductor (solid state) devices can be damaged easily by static electricity. Such components
commonly are called Electrostatically Sensitive Devices (ESD). Examples of typical ESD devices are integrated
circuits and some field-effect transistors and semiconductor chip components. The following techniques should
be used to help reduce the incidence of component damage caused by static electricity.

1. Immediately before handling any semiconductor component or semiconductor-equipped assembly, drain off

any electrostatic charge on your body by touching a known earth ground. Alternatively, obtain and wear a
commercially available discharging wrist strap device, which should be removed for potential shock reasons
prior to applying power to the unit under test.

2. After removing an electrical assembly equipped with ESD devices, place the assembly on a conductive sur-

face such as aluminum foil, to prevent electrostatic charge buildup or exposure of the assembly.

3. Use only a grounded-tip soldering iron to solder or unsolder ESD devices.

4. Use only an anti-static solder removal device. Some solder removal devices not classified as "anti-static" can

generate electrical charges sufficient to damage ESD devices.

5. Do not use freon-propelled chemicals. These can generate electrical charges sufficient to damage ESD

devices.

6. Do not remove a replacement ESD device from its protective package until immediately before you are

ready to install it. (Most replacement ESD devices are packaged with leads electrically shorted together by
conductive foam, aluminum foil or comparable conductive materials).

7. Immediately before removing the protective material from the leads of a replacement ESD device, touch the

protective material to the chassis or circuit assembly into which the device will by installed.

CAUTION : BE SURE NO POWER IS APPLIED TO THE CHASSIS OR CIRCUIT, AND OBSERVE ALL

OTHER SAFETY PRECAUTIONS.

8. Minimize bodily motions when handing unpackaged replacement ESD devices. (Otherwise harmless motion

such as the brushing together of your clothes fabric or the lifting of your foot from a carpeted floor can gen-
erate static electricity sufficient to damage an ESD device).

CAUTION. GRAPHIC SYMBOLS

THE LIGHTNING FLASH WITH APROWHEAD SYMBOL. WITHIN AN EQUILATERAL TRIANGLE, IS
INTENDED TO ALERT THE SERVICE PERSONNEL TO THE PRESENCE OF UNINSULATED “DANGER-
OUS VOLTAGE” THAT MAY BE OF SUFFICIENT MAGNITUDE TO CONSTITUTE A RISK OF ELECTRIC
SHOCK.

THE EXCLAMATION POINT WITHIN AN EQUILATERAL TRIANGLE IS INTENDED TO ALERT THE
SERVICE PERSONNEL TO THE PRESENCE OF IMPORTANT SAFETY INFORMATION IN SERVICE
LITERATURE.

Summary of Contents for LX-140

Page 1: ...MICRO COMPONENT...

Page 2: ...UBLESHOOTING 2 2 WAVEFORMS OF MAJOR CHECK POINT 2 11 BLOCK DIAGRAM 2 21 SCHEMATIC DIAGRAMS 2 23 WIREING DIAGRAM 2 31 PRINTED CIRCUIT DIAGRAMS 2 32 INTERNAL BLOCK DIAGRAM OF ICs 2 39 SECTION 3 EXPLODED...

Page 3: ...er be touched 4 Laser beams may damage the eyes Absolutely never permit laser beams to enter the eyes Also NEVER switch ON the power to the laser output part lens etc of the pick up if it is damaged 5...

Page 4: ...tive bag do not place the pick up on the bag This is because there is the possibility of damage by static electricity 4 To prevent AC leakage the metal part of the soldering iron should be grounded 5...

Page 5: ...arges sufficient to damage ESD devices 5 Do not use freon propelled chemicals These can generate electrical charges sufficient to damage ESD devices 6 Do not remove a replacement ESD device from its p...

Page 6: ...1 5 SPECIFICATIONS...

Page 7: ...1 6 MEMO...

Page 8: ...chassis ground unless otherwise specified 5 Keep the signal input as low as possible to avoid AGC and AC action TAPE DECK ADJUSTMENT CH1 CH2 Speaker Out Playback Mode Head Test Tape MTT 114 L ch R ch...

Page 9: ...2 2 CD PART TROUBLESHOOTING...

Page 10: ...2 3 OPEN CLOSE NG...

Page 11: ...2 4 READING DISPLAY CHECK ONLY CD DISPLAY...

Page 12: ...2 5 READING OK CHECK NO DISC DISPLAY...

Page 13: ...2 6 READING OK CHECK A NO DISC DISPLAY...

Page 14: ...2 7 READING OK CHECK B NO DISC DISPLAY...

Page 15: ...2 8 READING OK CHECK C NO DISC DISPLAY...

Page 16: ...2 9 READING OK CHECK D NO DISC DISPLAY...

Page 17: ...2 10 READING OK CHECK E NO DISC DISPLAY...

Page 18: ...2 11 WAVEFORMS OF MAKOR CHECK POINT...

Page 19: ...PINDLE DRIVE AND MOTOR WAVEFORM IC503 pin6 1 2 when TOC reading 5 TRACK DRIVE AND MOTOR WAVEFORM TP560 IC503 pin23 during normal play 6 RF TRACKING AND FOCUS ERROR WAVEFORM IC502 pin8 2 1 23 during no...

Page 20: ...2 13 AUDIO PART...

Page 21: ...2 14...

Page 22: ...2 15...

Page 23: ...2 16...

Page 24: ...e the TU101 Check the OSC waveform of TU101 pin8 Refer to IC102 Troubleshooting YES YES YES YES YES NO NO NO IC102 Troubleshooting Check the power input of IC102 pin8 Check the wavefor of IC102 Pin20...

Page 25: ...the IC103 Refer to IC103 Troubleshooting CE Chip Enable DI Data Input from u com DO Data Output to u com CLK Tuner mode clock Check the Clock of CE DI DO CLK Check the operation END YES YES YES YES N...

Page 26: ...the SW201 and HEAD connector Check the output to speaker Check the CN202 Check the CN201 YES YES YES YES NO NO NO REC Check the signal input of IC201 pin4 11 Check the of CN201 pin4 5 Check the oscil...

Page 27: ...2 20 MEMO...

Page 28: ...BLOCK DIAGRAM 2 21 2 22...

Page 29: ...2 23 2 24 SCHEMATIC DIAGRAMS FRONT POWER SCHEMATIC DIAGRAM...

Page 30: ...2 25 2 26 MAIN DECK SCHEMATIC DIAGRAM...

Page 31: ...2 27 2 28 TUNER SCHEMATIC DIAGRAM...

Page 32: ...2 29 2 30 CDP SCHEMATIC DIAGRAM...

Page 33: ...2 31 2 32 WIRING DIAGRAM...

Page 34: ...2 33 2 34 PRINTED CIRCUIT DIAGRAMS FRONT P C BOARD...

Page 35: ...2 35 2 36 MAIN P C BOARD...

Page 36: ...2 37 2 38 CDP P C BOARD...

Page 37: ...2 39 INTERNAL BLOCK DIAGRAM OF ICs IC300 LC87F73C8A 1 Pin Assignment...

Page 38: ...2 40 IC601 TDA7468D 1 BLOCK DIAGRAM...

Page 39: ...2 41 2 PIN CONNECTION...

Page 40: ...2 42 IC301 BU1923 1 BLOCK DIAGRAM...

Page 41: ...2 43 IC102LA1837 1 BLOCK DIAGRAM IC102LA1837 2 Test Circuit Diagram...

Page 42: ...2 44 IC103 LC72131D 1 Pin Assignments...

Page 43: ...2 45 IC201 AN7312 1 BLOCK DIAGRAM IC701 LA4631 1 BLOCK DIAGRAM...

Page 44: ...addresses are multiplexed on the same pins Row address RA0 RA10 column address CA0 CA7 BA Bank Select Address Selects bank to be activated during row address latch time Selects bank for read write dur...

Page 45: ...3 305 280 451 451 451 A46 295 294 293 291 292 290 A00 251 254 253 250 255 256 257 258 A40 266 266 270 252 268 267 269 NOTE Refer to SECTION 5 REPLACEMENT PARTS LIST in order to look for the part numbe...

Page 46: ...4 1 SECTION 4 SPEAKER SECTION MODEL LXS M140 855 854 853 852 851 861 850 850...

Page 47: ...4 2 MEMO...

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