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HE4K-DCK-1x & FV4K-DCK-1x
HARDWARE SPECIFICATION
CONFIDENTIAL
DOC-USR-0100-09
____________________________________________________________________________________
Z3 Technology, LLC
♦
100 N. 8th St. STE 250
♦
Lincoln, NE 68508-1369 USA
♦
+1.402.323.0702
APPENDIX 1: EXAMPLE OF PROPER THERMAL DISSIPATION
The following provides an example of successful thermal implementation of the HE4K-DCK-1X electronics.
Some but not all variants of the HE4K-DCK-1X and FV4K-DCK-1X include heat sink, cooper strip, and
thermal pad. Please contact [email protected] for details.
The following design has been tested in a thermal chamber and rated for operation up to 50 degrees Celsius.
The heatsinks, thermal pads and copper strips incorporated are designed to pass heat generated by the
chips to a steel enclosure where external ventilation is expected to dissipate it to the air.
The user is responsible for ensuring that the complete system has enough heat dissipation to ensure
proper operating temperature of all components at all times.
Refer to Section 4.0 for additional information.
Materials Needed:
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HE4K-DCK-1X 3-PCB Assembly
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Steel Enclosure
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Sony FCB-ER8300 Block Camera
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KEL Ribbon Cable
Screws and Nuts:
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4x Stand Offs M3 5x5.5x6 (Gold)
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4x Hex-Head Screws M3 5x3x4 (Gold)
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2x Pan-Head Screws M3x5 with Attached Two-Piece Washer (Silver)
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2x Pan-Head Screws M3x8 (Silver)
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2x Flat-Head Screws M3x6 (Black)
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4x Washers PW 3.2x8x0.8 (Silver)
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16x Flat-Head Finishing Screws M2x3 (Black)
Thermal Pieces:
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PH3 Heat Sink for CPU (60x38x0.21 mm)
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Thermal Pad 1 (40x25x2.5 mm)
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Thermal Pad 2-1 (15x15x1 mm)
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Thermal Pad 2-2 (15x15x.08 mm)
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2x Thermal Pad 3 (22x18x3 mm)
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Aluminum Heat Sink
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Thermal Paste