11
HE4K-DCK-1x & FV4K-DCK-1x
HARDWARE SPECIFICATION
CONFIDENTIAL
DOC-USR-0100-09
____________________________________________________________________________________
Z3 Technology, LLC
♦
100 N. 8th St. STE 250
♦
Lincoln, NE 68508-1369 USA
♦
+1.402.323.0702
HDMI FE
U1, Front End PCB
125 °C
ADI specifies a max 70 °C ambient
temperature.
Table 1 Temperature Critical Components
When designing the thermal dissipation for the HE4K-DCK-1X it is important to consider the thermal behavior
of
all
parts of the system, including the PCBs, enclosure, camera block, etc.
While the majority of the power dissipation comes from the components listed in the table above, other
parts such as t
he DDR chip, power IC’s and inductors also contribute some power
to the system and cause
the PCB to heat up. The heated-up PCB in turn will raise the ambient temperature of the entire system.
When incorporating the HE4K-DCK-1X boards into a final application, the systems engineer must ensure
proper thermal management. Failure to remove heat from the CPU may cause permanent damage to the
CPU and encoder and loss of warranty coverage.
Refer to APPENDIX 1: EXAMPLE OF PROPER THERMAL DISSIPATION for additional information.
