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LPM2100 bg NB Module Hardware Usage Guide

Shanghai Yuge Information Technology Co., Ltd.

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3.13.1 WAKEUP interface....................................................................................- 25 -
3.13.2 WAKEUP_OUT interface*....................................................................... - 26 -

Chapter 4. Overall RF technical indicators.......................................................................... - 27 -

4.1 Chapter overview....................................................................................................- 27 -
4.2 Antenna design....................................................................................................... - 27 -

4.2.1 Main antenna............................................................................................... - 27 -

4.3 RF signal line routing guide................................................................................... - 28 -
4.4 RF connector.......................................................................................................... - 29 -
4.5 Working frequency................................................................................................. - 30 -
4.6 Conducted transmit power and receive sensitivity.................................................- 30 -
4.7 RF power consumption characteristics...................................................................- 31 -

Chapter 5. Interface electrical characteristics.......................................................................- 32 -

5.1 Chapter overview....................................................................................................- 32 -
5.2 Range of working temperature............................................................................... - 32 -
5.3 Module IO level......................................................................................................- 32 -
5.4 Power supply.......................................................................................................... - 32 -
5.5 Electrostatic property..............................................................................................- 33 -
5.6 Reliability index..................................................................................................... - 33 -

Chapter 6. Structural and mechanical properties..................................................................- 35 -

6.1 Chapter overview....................................................................................................- 35 -
6.2 Exterior...................................................................................................................- 35 -

Chapter 7. Production and packaging...................................................................................- 37 -

7.1 Chapter overview....................................................................................................- 37 -
7.2 Module packaging and storage...............................................................................- 37 -
7.3 Production welding.................................................................................................- 37 -

Chapter 8. Abbreviation........................................................................................................- 39 -

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Summary of Contents for LPM2100 bg Series

Page 1: ...M2100 bg NB Module Hardware Usage Guide Number of pages 42 Hardware design version V1 0 Document version V15 Date 2019 11 5 LPM2100 bg NB Module Hardware Usage Guide V1 5 Shanghai Yuge Information Tec...

Page 2: ...0 John zhang Modify some information about hardware V1 1 interface changes V1 2 2019 6 11 John zhang Unified limit operating temperature Modify information related to IO voltage domain V1 3 2019 8 5 J...

Page 3: ...ap 9 3 2 2 Module pin description 10 3 3 Power interface 13 3 3 1 VBAT interface 13 3 3 2 VDD_EXT Voltage output 13 3 4 Switching machine reset mode 14 3 4 1 Boot 14 3 4 2 Shut down 14 3 4 3 Reset 15...

Page 4: ...Conducted transmit power and receive sensitivity 30 4 7 RF power consumption characteristics 31 Chapter 5 Interface electrical characteristics 32 5 1 Chapter overview 32 5 2 Range of working temperatu...

Page 5: ...ign 21 Figure 3 15 SIM card hot swap detection circuit 22 Figure 3 16 SPI read timing diagram 23 Figure 3 17 SPI write timing diagram 24 Figure 3 18 I2C interface reference circuit 24 Figure 3 19 Netw...

Page 6: ...Table 3 11 SPI Signal Definition 23 Table 3 12 I2C pin definition 24 Table 3 13 Network indicator pin definition 24 Table 3 14 Network indication status 25 Table 3 15 General GPIO Pin Definitions 25 T...

Page 7: ...series module of the wireless solution product It is intended to describe the hardware components and functional characteristics of the module solution application interface definition and usage instr...

Page 8: ...teristics The LPM2100 bg is a multi band NB IoT series module that complies with 3GPP Release 13 This series of modules has 98 pins 23 6 0 15 mm 19 9 0 15 mm 2 2 0 15 mm which can meet almost all M2M...

Page 9: ...and 16KB D Cache Operating Voltage Low voltage 2 45V 4 21V Typical voltage 3 6V Standard pressure 3 1V 4 2V Typical voltage 3 7V Power saving PSM mode power consumption 5uA Standby Sleep mode current...

Page 10: ...pgrade Serial port upgrade Temperature range Normal operating temperature 20 C to 75 C Extreme operating temperature 40 C to 85 C Storage temperature 45 C to 90 C AT command Support for standard AT in...

Page 11: ...odule RF circuit and cannot interact with the network Sleep The module turns off most of the functions and will be synchronized with the network Idle Power on and successfully register the network in...

Page 12: ...clude the following partial unit interface functions The functions of each unit interface will be described in detail in later chapters Power interface USIM interface UART interface Network status ind...

Page 13: ...cription IO Input or output PI Power input PO Power Output AI Analog input AO Analog output DI Digital input DO Digital output Table 3 2 Interface definition Pin Pin name IO Functional description Rem...

Page 14: ...r data reception IO voltage domain 30 TXD DO Master data transmission IO voltage domain Debug serial interface 19 DBG_RXD DI Module debug data reception Debug serial port 20 DBG_TXD DO Module debug da...

Page 15: ...PIO_15 IO Universal input output port Antenna interface 53 RF_ANT IO RF antenna interface 50 characteristic impedance Other function pins 10 V_RTC PO Output supply voltage Provide 1 1V voltage domain...

Page 16: ...to the power input and put 10pF 0 1uF 1uF ceramic capacitor and 100uF tantalum capacitor VBAT PCB traces are as short and thick as possible Figure 3 2 VBAT power supply To prevent damage to the modul...

Page 17: ...hether the module is powered on by querying the high and low levels of the VDD_EXT pin The following picture shows the boot sequence diagram Figure 3 4 boot timing diagram Table 3 3 Boot timing parame...

Page 18: ...tus TBD s Toff uart Shutdown time according to uart status TBD s 3 4 3 Reset The PIN15 signal of the LPM2100 bg series module is the RESET reset pin The application detects that the module is abnormal...

Page 19: ...ies modules provide three sets of UART interfaces Main serial port debug serial port auxiliary serial port The serial port level is the IO output level value The module is a DCE Data Communication Equ...

Page 20: ...smission IO voltage domain 22 CTS_AUX DI Request to send IO voltage domain 23 RTS_AUX DO Clear send IO voltage domain Table 3 7 Serial port logic levels Parameter Minimum Maximum Unit VIL 0 0 3 VDD_EX...

Page 21: ...be added externally to achieve level matching The chip connection method can refer to the following circuit Figure 3 10 UART level conversion circuit 3 6 Power saving technology LPM2100 bg supports th...

Page 22: ...etwork When the module is in the PSM mode related activities such as searching for cell messages cell reselection and connecting to the network are turned off However the T3412 timer continues to work...

Page 23: ...ption and the delay Such as remote shutdown of the gas business Figure 3 13 eDRX power saving technology 3 7 SIM interface The LPM2100 bg series module provides an ISO 7816 3 compliant SIM card interf...

Page 24: ...not recognize or remove the card Therefore the card slot should be placed as far as possible from the RF radiation of the antenna The trace should be as far away as possible from the RF power supply a...

Page 25: ...ction status Functional description 1 High SIM card insertion SIM_DECT is high 2 Low SIM card is pulled out SIM_DECT is low Figure 3 15 SIM card hot swap detection circuit It is recommended to add a d...

Page 26: ...und Table 3 10 ADC Signal Definition Pin Signal name IO High value Description 21 ADC AI Universal analog to digital converter interface 3 9 SPI interface The LPM2100 bg series module provides a set o...

Page 27: ...SCL DO I2C bus clock output Internal resistance pull up 33 SDA IO I2C bus data input and output Internal resistance pull up I2C reference circuit as shown below Figure 3 18 I2C interface reference ci...

Page 28: ...of the resistor in the network indicator circuit diagram can be adjusted according to the LED lamp parameters 3 12 General purpose GPIO interface The LPM2100 bg series module provides two GPIOs Some o...

Page 29: ...3 20 WAKEUP wake up module reference circuit 3 13 2 WAKEUP_OUT interface The LPM2100 bg series modules support the WAKEUP_OUT function When the module is in the sleep state if a wake up event is rece...

Page 30: ...rcuit design the trace between the module and the antenna must be guaranteed to 50 ohms The antenna is a sensitive device that is susceptible to the external environment For example module size antenn...

Page 31: ...e parasitic capacitance of the TVS tube pin itself in antenna matching must be small to avoid signal interference Parasitic capacitance must be less than 0 5pF or even lower 4 3 RF signal line routing...

Page 32: ...the third layer microstrip transmission line structure Figure 4 4 Complete structure of the strip line 4 4 RF connector If you need to use the RF connector connection during the design process the ant...

Page 33: ...tions Frequency Range DC to 6GHZ 40 C to 85 C Characteristic impedance 50 40 C to 85 C 4 5 Working frequency Table 4 3 RF frequency table LPM2100_ bx Band Uplink frequency Download frequency LPM2100_...

Page 34: ...dBm Table 4 5 Conducted receiving sensitivity indicators Directory sensitivity Typical B1 127dBm 1dB B3 127dBm 1dB B5 127dBm 1dB B8 127dBm 1dB B20 127dBm 1dB B28 127dBm 1dB 4 7 RF power consumption ch...

Page 35: ...dule IO level The port IO levels of the LPM2100 bg series modules are as follows Which corresponds to 1 8V SIM application SIM_VDD is 1 8V corresponding to 3V SIM application SIM_VDD is 3V Table 5 2 E...

Page 36: ...the TVS The protective device PCB layout should be as close as possible to the V shaped line to avoid the T shaped line The ground plane around the module guarantees integrity and should not be split...

Page 37: ...mperature 20 Working mode normal work Test duration 30 Cycles 1 h 1h cycle JESD22 A 105 B Visual inspection normal Function check normal RF indicator check normal Drop test Height 0 8 m 6 sides each t...

Page 38: ...mechanical properties 6 1 Chapter overview Exterior Module mechanical size 6 2 Exterior The LPM2100 bg series module is a single sided layout PCBA The module appearance is shown below Figure 6 1 Appea...

Page 39: ...LPM2100 bg NB Module Hardware Usage Guide Shanghai Yuge Information Technology Co Ltd 36 Figure 6 3 Bottom view of the LPM2100 bg series module unit MM...

Page 40: ...h within 72 hours and the module can directly perform reflow soldering or other high temperature process If the module is in other conditions it needs to be baked before the patch If the module needs...

Page 41: ...1 Reflow soldering temperature graph Table 7 1 Reflow process parameter table Warm zone Time key parameter Preheating zone 40 165 Heating rate 1 s 3 s Temperature zone 160 210 t1 t2 70s 120s Recircul...

Page 42: ...rate CTS Clear to Send DTR Data Terminal Ready DL Down Link DTE Data Terminal Equipment EMC Electromagnetic Compatibility ESD Electrostatic Discharge LED Light Emitting Diode NC Not Connected USIM Uni...

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