CLM920_RC3(RV3 RE3)LCC Series CAT1 Module Hardware Manual
Shanghai YUGE Information Technology Co., Ltd.
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Chapter7. Packaging and production
7.1 Overview of this chapter
Module packaging and storage
Production welding.
7.2 Module packaging and storage
The CLM920_RC3 module is packaged in a tray and packaged in a vacuum-sealed bag, with
10PCS as a tray and 100PCS as a package, shipped in a vacuum-sealed bag.
The storage of CLM920_RC3 module module should follow the following conditions
：
The moisture sensitivity level of the module is level 3.
When the ambient temperature is less than 40 degrees Celsius and the air humidity is less
than 90%, the module can be stored in a vacuum-sealed bag for 12 months.
When the vacuum sealed bag is opened, if the ambient temperature of the module is less
than 30 degrees Celsius and the air humidity is less than 60%, the factory can complete
the placement within 72 hours, and the module can be directly reflow soldered or other
high temperature processes.
If the module is under other conditions, it needs to be baked before the placement.
If the module needs to be baked, after removing the module packaging, please bake at 125
degrees Celsius (to allow fluctuations of 5 degrees Celsius up and down) for 8 hours.
7.3 Production welding
The CLM920_RC3 module is packaged in an anti-static tray. The SMT cable needs to be
equipped with a Tray module. It is recommended to use a reflow oven with a temperature of
7 or more
；
In order to ensure the quality of the module paste, the thickness of the steel mesh
corresponding to the pad part of the CLM920_RC3 module is recommended to be
0.18mm.
The recommended temperature for reflow soldering is 235 ~ 245
º
C, not to exceed 260
º
C.
When layouting on both sides of the PCB, the layout of the LCC module must be processed
