A
B
C
D
E
F
G
H
1
2
3
4
5
6
DP-U50
E-28/J-26
E-29/J-27
■
PRINTED CIRCUIT BOARD (Foil side)
1
2
3
4
1
40
41
80
81
120
121
160
1
24
25
48
1
28
29
56
57
84
85
112
1
4
5
8
1
7
8
14
1
20
21
40
1
44
45
88
89
132
133
176
1
12
13
24
25
36
37
48
1
7
8
14
1
14
15
28
1
14
15
28
1
10
11
20
1
4
5
8
1
4
5
8
1
4
5
8
1
15
16
30
1
4
5
8
U, C, A, B, G only
DSP P.C.B.
(Lead Type Device)
PC IN
AUX 1 IN
AUX 2 IN
PRE OUT
ANALOG
USB
COAX IN
OPT IN
AUX 1
OPT IN
OPT OUT
DIGITAL
PC
E_B
KEY0
+5S
LED A1
LED TU
+5M
CCBDI
FLCE
REM
E_A
P SW
LED PC
LED A2
/ICD
GNDD
CCBCLK
GNDD
FR
OM :
OPERA
TION (1)
T MUTE
SW MUTE
CLK
VOLCE2
PRT I
SP ON
A MUTE
POW
T-FAULT
PHONE
DATA
VOLCE1
PRT DC
E
PS
FR
OM :
MAIN
AGND
RLCH
RRCH
AGND
AGND
+9V
-15V
DGND
+5D SW
CENTER
LFE
AGND
RCH
LCH
+5A
+12V
+15V
AC DET
+5D SUB
Point
q
(Pin 1 of IC417)
V : 2V/div, H : 50 nsec/div
DC, 1 : 1 probe
0V
Point
w
(Pin 4 of IC430)
V : 1V/div, H : 50 nsec/div
DC, 1 : 1 probe
0V
Point
e
(Pin 74 of IC436)
V : 2V/div, H : 0.1
µ
sec/div
DC, 1 : 1 probe
0V
Point
r
(Pin 47 of IC475)
V : 2V/div, H : 50 nsec/div
DC, 1 : 1 probe
0V
Ref. No.
Location
D413
C2
D414
C2
D415
C2
D416
C2
D417
C2
D418
C2
D419
C2
D420
C2
D437
C5
D440
D2
D441
D2
D442
D2
D443
D2
D444
D2
D445
D2
D446
D2
D447
D2
Ref. No.
Location
IC401
D5
IC406
C3
IC412
D3
IC413
C5
IC416
D5
IC417
C4
IC418
D4
IC430
D3
IC432
C4
IC436
D5
IC438
C5
IC439
C3
IC440
C3
IC454
C2
IC458
C2
IC471
D2
IC473
D1
IC474
D2
IC475
D3
IC477
C2
IC478
D2
●
Semiconductor Location
Ref. No.
Location
Q401
D3
Q402
C2
Q403
C2
Q404
C2
Q405
C2
Q410
C1
Q411
C2
Q417
C1
Q418
C2
Q420
D3
Q421
D3
Q423
D2
Q424
D2
Q427
D2
Q428
D2
NOTE)
The DSP P.C.B. actually has a four-layer pattern structure (part face pattern, internal pattern
1, internal pattern 2 and solder face pattern) but it is shown as "part face p solder
face pattern" in this diagram.
NOTE)
DSP P.C.B.は、4層パターン構造(部品面パターン、内層1パターン、内層2パターン、ハンダ面パ
ターン)ですが、本図のDSP P.C.B.は、部品面パターン+ハンダ面パターンを表記しております。