AG-Stomp
14
Fig.4
4.
Heat Sink (Manhour requirement: 25 min.)
4-1.
Remove the bottom case. (See Procedure 1.)
4-2.
Remove the DM circuit board. (See Procedure 2.)
4-3.
Remove the two (2) screws marked [A-a] from the
soldered face of the DM circuit board and the three
(3) screws marked [A-b] from IC112, IC113 and
IC114. The heat sink can then be removed from the
DM circuit board. (Fig. 4)
[A-a]
[A-a]
[A-b]
IC114
IC113
IC112
Heat Sink
Summary of Contents for AG-STOMP GA 011589
Page 4: ...AG Stomp 4 ...
Page 10: ...AG Stomp 10 CIRCUIT BOARD LAYOUT 1 2 1 2 2 2 PN DM 2 2 DM PN ...
Page 22: ...AG Stomp 22 A A DM 1 2 Circuit Board ...
Page 23: ...23 AG Stomp Pattern side A A DM 2 2 Circuit Board Pattern side ...
Page 25: ...25 AG Stomp Component side Component side 3 to DM1 2 CN2 to DM1 2 CN1 to DM1 2 CN103 A A A A ...
Page 26: ...AG Stomp 26 to SW to SW A A A A PN 1 2 Circuit Board PN 2 2 Circuit Board ...
Page 27: ...27 AG Stomp to PN1 2 CN305 to SW to SW o SW A A A A Pattern side Pattern side ...