Yaesu FT-757GX II, Technical Supplement

Page: 7 / 70

BASIC SOLDERING PRACTICE
'
"'"'�''"''''
(
1)
Prepare soldering iron and
solder. The tip of the iron
should
be thoroughly
tinned and wiped clean of
excess solder .
(2) Apply soldering iron to
sur face to be soldered. Do
not press the iron into the
sur face.
(3) Apply solder to junction
o f iron and heated sur face.
(
4)
W
h e n enough solder is
applied, remove solder.
Continue to apply heat just
until solder flows cleanly.
(5) Remove iron from work.
Do not apply more heat
than necessary for good
solder flow.
Soldering to terminal posts:
(Be certain to apply heat to
both po st a
n
d
w
ir e .)
EXAMPLES OF POOR SOLDERING PRACTICE
Unwanted solder bridge con-
necting two tracks (caused by
use of too much solder)
"Cold joint" (caused by in­
sufficient heat to part of
work, resulting in poor solder
flow)
Unstable joint (caused by in­
su fficient heat or solder)
Proper
soldering:
A
smooth fillet of solder
surrounds the lead and just
covers the foil pad.
If you have previously lifted a trace, make an etch
cut on each side of the lifted trace as shown in
the drawing, and install a wire bridge.
Cut
Cut
Copper Trace
Squa re Cut
.
0
6
"
Coat Cut Area With Eastman
910
After Soldering Wire Bridge
.02"
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