14
Suitable for desoldering of SMD components such as SOIC, CHIP, QFP, PLCC,
BGA etc.
QFP De-soldering
1.
Melt the solder:
Hold the iron so that the nozzle is located directly over, but not
touching the IC and allow the hot air to melt the solder. Be careful not to touch the
leads of the IC with the nozzle.
2.
Remove the IC:
Once the solder has melted, remove the IC by lifting the pliers.
3.
Turn the power switch off:
After the power switch is off, an automatic blowing
function begins sending cool air through the pipe in order to cool both the heating
element and the handle. So do not disconnect the plug during this cooling process.
4.
In case you don’t use the unit for a long time, disconnect the plug.
Note
: After the power switch off about one minute later, the temperature will fall
down to 75
℃
(167
℉
) and power automatically shut off.
5.
Remove any remaining solder:
After removing the IC, cleaning the remaining
solder chips with a wick or desoldering tool.
Note:
For SOP, PLCC etc. would recommend by using tweezers iron to desolder.
QFP Soldering
1.
Apply the solder paste:
Apply the proper quantity of solder paste and flux
(preferably no-clean) and place install the SMD on the PCB.
2.
Preheat SMD.
3.
Soldering:
Heat the lead frame evenly.
4.
Washing:
When soldering is completed, wash the area with a defluxer.
Note:
While there are many advantages of hot air SMD rework, it is also possible
to have defects for soldering BGA. Will recommend to inspect all soldering joints
closely.
PROCEDURE FOR REPLACING HOT AIR GUN HEATING
ELEMENT
1.Unscrew the 3 screws on handle then take out the handle cover.
(See Fig.1 below)
2.
Disconnect the grounding wire jack and pull the heating element out from the
stainless steel tube.
Important:
Do not damage or loss the quartz glass and /or insulation
mica inside of the stainless steel tube.
Caution
:
The main swich must be “off” and allow the iron to cool
before attemptling the following procedure
