SYS-ITX-N-3800/Best Practices
v1.0
www.winsystems.com
Page 36
Contact Points
For maximum reliability, WINSYSTEMS boards typically use connectors
with gold finish contacts. It is critical that the contact material in the
mating connectors is matched properly (gold to gold and tin to tin).
Contact areas made with dissimilar metals can cause oxidation/corrosion,
resulting in unreliable connections.
Power Down
Make sure that power has been removed from the system before making
or breaking any connections.
I/O Connections OFF—
I/O Connections should also be off before
connecting them to the embedded computer modules or any I/O cards.
Connecting hot signals can cause damage whether the embedded system
is powered or not.
Conformal Coating
Applying conformal coating to a WINSYSTEMS product does not in itself
void the product warranty, if it is properly removed prior to return.
Coating may change thermal characteristics and impedes our ability to
test, diagnose, and repair products. Any coated product sent to
WINSYSTEMS for repair will be returned at customer expense and no
service will be performed.
Operations/Product Manuals
Every embedded computer has an Operations manual or Product manual.
Periodic Updates—
Operations/Product manuals are updated often.
Periodically check the WINSYSTEMS website (
Check Pinouts—
Always check the pinout and connector locations in the
manual before plugging in a cable. Many I/O modules have identical
headers for different functions and plugging a cable into the wrong
header can have disastrous results.
Contact an Applications Engineer—
If a diagram or chart in a manual
does not seem to match your board, or if you have additional questions,
contact a WINSYSTEMS Applications Engineer at: +1-817-274-7553.
Power Supply OFF
—The power supply should always be off before it is
connected to the I/O module. Do not hot-plug the SYS-ITX-N-3800 on a host
platform that is already powered.
