Winbond W91550DN Series, Manual

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W91550DN SERIES
Publication Release Date: November 1997
- 31 - Revision A3
BONDING PAD DIAGRAM
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(0, 0)
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Notes:
1. The substrate must be connected to V
SS
.
2. The chip size is 3010.00
×
3060.00
µ
m
2
Unit:
µ
m
PAD
NO.
PAD
NAME
X Y PAD
NO.
PAD
NAME
X Y
1
KMUTE
-1234.60 1369.20 17 5C -1359.60 -1127.00
2 COM3 -1374.60 1322.70 18 6A -1359.60 -1281.50
3 1A -1359.60 1052.80 19 6B -1117.60 -1384.60
4 1B -1359.60 905.20 20 6C -970.00 -1384.60
5 1C -1359.60 741.40 21 7A -811.00 -1384.60
6 2A -1359.60 593.80 22 7B -658.60 -1384.60
7 2B -1359.60 430.00 23 7C -494.80 -1384.60
8 2C -1359.60 282.40 24 8A -342.40 -1384.60
9 3A -1359.60 118.60 25 8B -183.40 -1384.60
10 3B -1359.60 -29.00 26
S/ M
-28.90 -1384.60
11 3C -1359.60 -192.80 27 8C 128. 00 -1384.60
12 4A -1359.60 -340.40 28 9A 280.40 -1384.60
13 4B -1359.60 -504.20 29 9B 439.40 -1384.60
14 4C -1359.60 -651.80 30 9C 587.00 -1384.60
15 5A -1359.60 -810.80 31 10A 746.00 -1384.60
16 5B -1359.60 -963.20 32 10B 898.40 -1384.60