GEM 2 Module Hardware Integration Guide
Version 0.1
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Module Layout Considerations
1. Good: Place module antenna side as close as possible to the board edge. Better:
Allow module antenna area to overhang the edge of the board by ~5.6mm.
2. Good: Define a copper keepout area approx. 53mm x 20mm, 6mm in from module
edge. Better: Increase the keepout area, starting at 6mm in from module edge.
3. Mechanical items (especially metal) should be kept as far as possible from the
module antenna in all directions, including above and below the board surface. If
possible, move mechanical items out and away from the keepout area.
4. Bottom layer ground plane under the module strongly recommended. Connect all
ground pins directly to ground plane.
5. Top layer ground plane is good to have wherever practical, but avoid having copper
directly under the module.
6. Place Via stitching where both top and bottom layer ground planes are used,
especially along the plane edges adjacent the module.
Top‐side area directly under the module should be kept clear of copper, silkscreen and
vias
