Assembly Instructions for SCA6x0 and SCA10x0 series
TN71
VTI Technologies Oy
9/12
www.vti.fi Rev.1.0
6
Hand Soldering Guidelines
For hand soldering of the DIL component, VTI recommends eutectic tin-lead solder due to the
lower melting point compared to lead-free solders. Key thing is that as soon as the solder flows the
soldering iron must be removed from the board. The package temperature should be kept under
280ºC (max 250ºC recommended) and all mechanical stresses in the pin should be minimized. It
should be noted, that also PCB material might damage if too much heat or force is used.
Generally the hand soldering of the DIL component can be done in two different ways:
Method A
: Soldering of components with tin wire and soldering iron
Method B
: Soldering by applying solder paste onto PCB land pads and
then
using reflow heating
or soldering iron to melt the paste and achieve the soldered joint.
METHOD A: Soldering of components with soldering iron
Use the tin wire and soldering iron to solder the component onto PCB. Do not touch the package
plastic body with the soldering iron, soldering iron should touch only the PCB pad and through that
the heat should be conducted to the tin wire and component lead. VTI has used 315ºC setting
temperature for component soldering. The temperature on the tip of the tool is 270...275ºC.
Soldering process takes only few seconds for each pin.
For leaded soldering we have used
Multicore Sn60Pb40 and for lead-free soldering Almit KR-19SHrma flux-cored solder wire.
Figure 10
: Using tin wire and soldering iron for hand soldering.
METHOD B: Soldering by applying solder paste and then using reflow heating or soldering
iron
1. Apply the solder paste onto the PCB land pads. The paste can be applied by two different
methods.
•
Manual solder paste printing through a stencil with normal openings designed for the
DIL component. .
•
Needle dispensing of solder paste manually onto the PCB pads. VTI recommends use
of a microscope in manual solder paste dispensing. Dispensing needle tip size can be
0.12"-0.16".
2. Place the component gently on top of the solder paste. To avoid solder bridging, push only very
gently on top of the component.
Melt the solder paste by putting the part through reflow oven
or
by using soldering iron as mentioned
in the previous part.
