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Assembly Instructions for SCA6x0 and SCA10x0 series 

                                                                                                                                                                                                                         TN71 

 
VTI Technologies Oy 

 

10/12 

www.vti.fi  Rev.1.0 

 

7 Rework 

Guidelines 

If it becomes necessary to rework a SCA6x0/SCA10x0 series 
component, the preferred way to remove the component is by hot 
air. Use of a hot air rework station with a vacuum chuck, is the 
preferred method. A key issue in using hot-air is preventing 
thermal damage to the component or adjacent components. 

 

If hot air rework station is not available, rework with thermal 
tweezers is also an acceptable alternative. This method is used at 
VTI e.g. for failure analysis purposes. This technical note 
describes VTI's rework procedure. 

 

Removing of the component with hot iron only is difficult as it is easy to get the part too hot and 
destroy it. It is not recommend method if failure analysis or re-use of the component is desired. 

 

 

7.1  Instructions for desoldering and removing of component 

 
Soldering Station (Pace SensaTemp ST25E-PS90) and thermal 
tweezers (Pace Thermotweez) with Pace 1121-0416-P1 tool head are 
used for de-soldering and removing of the component. 
 
 
 
 
 
 
 
 
 
 
 
 
 
 
 

 Figure 

11. 

Thermal tweezers, Pace Thermotweez

   Figure 12: 

Tool head, Pace 1121-0416-P1 

 

 

The plastic molding compound on the component is LCP (liquid crystal polymer) which withstands 
very high temperatures and is good material for Pb-free assembly. LCP's melting point is 335ºC. 
However, the mechanical properties start to change already near 280ºC. If the pins are heated too 
long the plastic around pin will be softened and if there at the same time is some stress on the pin 
there is a risk that pin might move and cause increased reliability or wirebond break inside housing.  

 

In order to melt all pins simultaneously, tweezers are recommended for de-soldering of the 
component. Also with tweezers, special care must be taken if failure analysis or re-use of the 
component is desired.  

 

In the component removal process, the temperature setting in soldering station is no315ºC.  
The temperature on the tip of the tool is 270...275ºC. Tool is pressed against pins only for few 
seconds. Same temperature is used both for Pb-free and SnPb-solder joints, even though SnPb 
solders melt already below 200ºC. Some temperature adjustment might be needed. Especially if 
tool head is old and 'dirty' temperature needs to be increased.  
 
 

Summary of Contents for 551-1013-2

Page 1: ...out 5 5 2 Solder paste and Cleaning process 5 5 3 Stencil 6 5 4 Paste printing 6 5 5 Component picking and placement 6 5 6 Reflow soldering 6 5 7 Moisture sensitivity level MSL classification 7 5 8 Inspection 8 6 Hand Soldering Guidelines 9 7 Rework Guidelines 10 7 1 Instructions for desoldering and removing of component 10 8 Environmental Aspects 11 9 References 11 10 Document Change Control 12 A...

Page 2: ...e applications 2 VTI S DIL 8 and DIL 12 packages The SCA6x0 and SCA10x0 series products are SMD DIL 8 DIL 12 components pick and place mountable and reflow solderable These components are completely lead free and designed to meet the demanding lead free soldering processes The package consists of a pre molded plastic housing with a copper based lead frame having gull wing type of leg pins on the s...

Page 3: ... in Figure 3 Figure 3 Outline and dimensions for DIL 12 package 4 Tape and reel specifications Packing tape dimensions are presented in figure 4 The unreeling direction and component polarity on tape are presented in figure 5 Reel dimensions are presented in figure 6 Figure 4 Packing tape dimensions for the DIL 8 and DIL 12 package All dimensions in millimeters mm ...

Page 4: ...y 4 12 www vti fi Rev 1 0 Figure 5 Package orientation on the tape and unreeling direction on tape A W Nmin W1 W2max M 330 24 102 24 4 2 30 4 Ø13 0 0 25 Figure 6 Reel dimensions All dimensions in millimeters mm Direction of unreeling PIN 1 IDENTIFIER DRAWING FOR REFERENCE ONLY ...

Page 5: ...with lead free SAC tin silver copper solder The SAC solder paste composition should be near eutectic The melting point of lead free SAC solder can vary between 217 221ºC depending on the composition of solder alloy In order to guarantee full RoHS compatibility lead free solder should be used for the soldering of VTI s DIL component Also traditional eutectic SnPb solder can be used for soldering th...

Page 6: ...nozzle is used Pick up nozzles are available in various sizes and shapes to suit a variety of different component geometries VTI s DIL packages are relatively large and heavy and on the other hand accelerometers require as accurate positioning as possible For this reason it is recommended that different pick up nozzles are tested to find the best one The polarity of the part must be assured in tap...

Page 7: ... should be in contact with DIL component s solder joint and others to the appropriate spots on a circuit board e g corner center bottom of the board etc The reflow profile should be adjusted according to the measured data so that each solder joint experiences an optimal reflow profile The temperature gradient should be as small as possible across the circuit board Extreme caution has to be taken i...

Page 8: ...solder joints can be done easily since the solder joints are clearly seen A visual inspection of the solder joints with conventional AOI automatic optical inspection system can be used Also X ray inspection can be used Cross sectional analysis is also an approved method to inspect how well solder has wetted the pads of component Cross sectional analysis is not used for production inspection but if...

Page 9: ... package plastic body with the soldering iron soldering iron should touch only the PCB pad and through that the heat should be conducted to the tin wire and component lead VTI has used 315ºC setting temperature for component soldering The temperature on the tip of the tool is 270 275ºC Soldering process takes only few seconds for each pin For leaded soldering we have used Multicore Sn60Pb40 and fo...

Page 10: ...ng and removing of the component Figure 11 Thermal tweezers Pace Thermotweez Figure 12 Tool head Pace 1121 0416 P1 The plastic molding compound on the component is LCP liquid crystal polymer which withstands very high temperatures and is good material for Pb free assembly LCP s melting point is 335ºC However the mechanical properties start to change already near 280ºC If the pins are heated too lo...

Page 11: ...l Aspects VTI Technologies respects environmental values and thus its DIL packages are lead free and RoHS compatible VTI Technologies sensors should be soldered with lead free solders in order to guarantee full RoHS compatibility 9 References JEDEC Electronic Industries Alliance Inc Moisture ReflowSensitivity Classification for Non Hermetic Solid State Surface Mount Devices J STD 020C Handling Pac...

Page 12: ... and SCA10x0 series TN71 VTI Technologies Oy 12 12 www vti fi Rev 1 0 10 Document Change Control Version Date Change Description 1 0 22 04 2008 Release VTI Technologies reserves all rights to modify this document without prior notice ...

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