Technical Note 71
TABLE OF CONTENTS
Table of Contents .....................................................................................................................1
1
Objective ..............................................................................................................................2
2
VTI'S DIL-8 and DIL-12 packages .......................................................................................2
3
Package Outline and Dimensions......................................................................................2
4
Tape and reel specifications ..............................................................................................3
5
Printed Circuit Board (PCB) Level Guidelines ..................................................................5
5.1
Recommended PCB pad layout................................................................................................5
5.2
Solder paste and Cleaning process .........................................................................................5
5.3
Stencil .........................................................................................................................................6
5.4
Paste printing .............................................................................................................................6
5.5
Component picking and placement .........................................................................................6
5.6
Reflow soldering ........................................................................................................................6
5.7
Moisture sensitivity level (MSL) classification........................................................................7
5.8
Inspection ...................................................................................................................................8
6
Hand Soldering Guidelines ................................................................................................9
7
Rework Guidelines ............................................................................................................10
7.1
Instructions for desoldering and removing of component ..................................................10
8
Environmental Aspects ....................................................................................................11
9
References.........................................................................................................................11
10
Document Change Control...............................................................................................12
Assembly Instructions for SCA6x0 and SCA10x0 series
