Voxtel VS600, Service Manual

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VS600 Service Manual
VOXTEL Technical Documentation 53
SYMTPOM PROBABLE CAUSE VERIFICATION AND REMEDY
a.)
2-in-1loudspeaker Subs
loudspe
defective
titute a known good
aker. If the fault is still
present, proceed to b.
4. Incoming call alert audio
distorted
is too
low.
b.)
Upper board
bly
R oard
or volume
assem
defective
eplace a known good upper b
assembly. Verify that the fault has
been cleared and reassemble the
handset with the new upper board
assembly.
a.)
Microphone
defective
the disassembly
Replace the microphone as
described in
procedure. If fault is not cleared,
proceed to b.
5. Handset transmit audio is
weak. (usually indicated by
called parties complaining of
difficulty in hearing voice.)
defective
embly.
b.)
Main board
assembly
Replace a known good main board
assembly. Verify that the fault has
been cleared and reassemble the
handset with the new main board
ass
a.)
Connections to or
from main board
assembly
tive defec
Check connection from the earpiece
to the main board assembly. If the
connector is not fault, proceed to b.
b.)
2-in-1
loudspeaker
defective
Temporarily replace the speaker
assembly with a known good one.
Ensure good connection by placing
a call and verify the improvement in
earpiece audio. If fault is cleared,
reassemble the handset with the
good assembly. If not, proceed to c.
6. Received audio from
receiver is weak or distorted.
c.)
board
defective
Main
assembly
Replace a known good main board
assembly. Verify that the fault has
been cleared and reassemble the
handset with the new main board
assembly.
a.)
SIM card
defective
Check the SIM card contacts for dirt.
and verify that the SIM card has
Clean if necessary, and check if fault
has been cleared. If the contacts are
clean, insert a known good one into
the handset. Turn on the handset
been accepted. If fault is still
present, proceed to b.
7. Handset will not
recognize or accept SIM
card.
rd
mbly
fy that the fault has
b.)
Main boa
asse
defective
Replace a known good main board
assembly. Veri
been cleared and reassemble the
handset with the new main board
assembly.