TSSP60..
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Vishay Semiconductors
Rev. 2.1, 10-Apr-2019
5
Document Number: 82483
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT
www.vishay.com/doc?91000
PACKAGE DIMENSIONS
in millimeters
ASSEMBLY INSTRUCTIONS
Reflow Soldering
• Reflow soldering must be done within 72 h while stored
under a max. temperature of 30 °C, 60 % RH after
opening the dry pack envelope
• Set the furnace temperatures for pre-heating and heating
in accordance with the reflow temperature profile as
shown in the diagram. Exercise extreme care to keep the
maximum temperature below 260 °C. The temperature
shown in the profile means the temperature at the device
surface. Since there is a temperature difference between
the component and the circuit board, it should be verified
that the temperature of the device is accurately being
measured
• Handling after reflow should be done only after the work
surface has been cooled off
Manual Soldering
• Use a soldering iron of 25 W or less. Adjust the
temperature of the soldering iron below 300 °C
• Finish soldering within 3 s
• Handle products only after the temperature has cooled off
2.35
R 1.7
5.51
0.5 ± 0.15
3 x 1.27 = 3.81
2.6
7.5
7.2
4x
1.27
5.3
2.9
4
2.2
Pick and place area. TR taping
2.2
3 x 1.27 = 3.81
1.27
0.9
2.8
specifications
according to DIN
technical drawings
Not indicated tolerances ± 0.3
Pick and place area. TT taping
Footprint
(1.5)
(1.4)
Issue: 8; 02.09.09
16776
Drawing-No.: 6.544-5341.01-4
A
A
0.1
0.1
0.3
0.4
1
4
