Vincotech flow2 Handling Instruction Download

Page: 1 / 25

Flow

2 packages

Handling Instruction

Flow2-P-*-HI

Page
1 of 25

Soldering option for Press-fit

17.02.2014

Őri A

Bauer Gy

New document

29.10.2013

Zs.Gyimóthy T. Gyetvai

Ver

Alteration

Date

Des. / Mod.

Appr.

Handling Instruction

for

flow 2

packages

It is valid for all type of

flow2

modules:

12/13 mm & 17 mm housing, solder & Press fit pins

Summary of Contents for flow2

Page 1: ...of 25 02 Soldering option for Press fit 17 02 2014 ri A Bauer Gy 01 New document 29 10 2013 Zs Gyim thy T Gyetvai Ver Alteration Date Des Mod Appr Handling Instruction for flow 2 packages It is valid...

Page 2: ...8 2 5 2 For 12 13 mm type module 9 2 5 2 1 Mounting with distance of 13 mm 9 2 5 2 2 Mounting with distance of 12 mm 10 3 Specification for base plate 11 4 Specification for heat sinks 13 5 Specificat...

Page 3: ...plate 12 Figure 9 Fingerprint on the base plate 12 Figure 10 Recommended tooling for the press in process 14 Figure 11 Recommended hole and cutout dimensions for bottom part of press in tool 15 Figur...

Page 4: ...esign of the Press fit pins prevents higher than 0 1 mm deformation of pins during pressing in process The tension of the pin must not exceed 5 N at a maximum substrate temperature of 100 C 2 Specific...

Page 5: ...pins The module must be screwed to the PCB with 4 screws type BN82428 D 2 5 mm and L 6 mm before soldering the pins into the PCB Mounting torque 0 4 Nm After screwing all pins must be soldered into th...

Page 6: ...etvai Ver Alteration Date Des Mod Appr 2 4 PCB cutouts for insulating ribs screwing holes 2 4 1 For 17 mm type module Press fit and solder pins Figure 3 PCB s Cutout for 17 mm type modules 2 4 2 For 1...

Page 7: ...fit 17 02 2014 ri A Bauer Gy 01 New document 29 10 2013 Zs Gyim thy T Gyetvai Ver Alteration Date Des Mod Appr 2 4 2 2 OPTION 2 Mounted on module with distance of 12 mm washer DIN125A M2 5 should be u...

Page 8: ...modules only The number and the position of the fixing points depend on the design of the circuit location of different masses like capacitors or inductors and the environment of the system General re...

Page 9: ...2 5 2 For 12 13 mm type module 2 5 2 1 Mounting with distance of 13 mm 2 5 2 1 1 Option 1 Without spacers for Press fit and solder pin modules 2 5 2 1 2 Option 2 With spacers for Press fit pin module...

Page 10: ...ion Date Des Mod Appr 2 5 2 2 Mounting with distance of 12 mm 2 5 2 2 1 Option 1 Without spacers for Press fit and solder pin modules Option 2 With spacers for Press fit pin modules only Mounting heig...

Page 11: ...g values it has no effect to the thermal properties If copper became visible we are talking about scratch Depth and width of the scratch can t exceed 200 and 800 m Length of the scratch doesn t matter...

Page 12: ...HI Page 12 of 25 02 Soldering option for Press fit 17 02 2014 ri A Bauer Gy 01 New document 29 10 2013 Zs Gyim thy T Gyetvai Ver Alteration Date Des Mod Appr Figure 7 Polished base plate Figure 8 Dis...

Page 13: ...eneous layer of thermal conductive paste over the whole backside of the module with a thickness of min 0 04 mm and max 0 09 mm Thicker thermal paste will raise the value of the Rth 5 2 OPTION 2 Pre ap...

Page 14: ...ss The module can be pressed into the PCB from the top as Figure 10 shows or the PCB can be pressed onto the module the module is below the PCB It is suggested to press the module into the PCB from th...

Page 15: ...of the holes cut outs for the pins in the supporting tool is 1 7 mm 4 mm depends on the positioning accuracy The minimal supporting place around the pin is 2 mm If the pins are close to each other th...

Page 16: ...ithout thermal interface material The material of the press in tool Tempered aluminum alloy grade 7075 T6 with yield strength of 430 MPa and hardness of 160 HB or Tool steel grade 21 MnCr 5 with yield...

Page 17: ...ot to damage dramatically the phase change material during the press in process Small damages max 0 6 mm are allowed Tool steel grade 21 MnCr 5 with yield strength of 660 MPa and hardness of 330 HB or...

Page 18: ...B 7 3 Process control parameters In case the press machine is equipped with the possibility to record the force stroke values during the process the following quality relevant values should be taken i...

Page 19: ...o be o higher than 90 N x number of the pins o smaller than 150 N x number of the pins These limits are marked on the diagram If the press in force does not fit in the interval defined above it can in...

Page 20: ...of Press fit modules 8 1 Press out tool The specific tool to disassemble the modules from the PCBs has two parts similarly to the press in tool The lower part serves as a backing of the PCB It has a...

Page 21: ...P HI Page 21 of 25 02 Soldering option for Press fit 17 02 2014 ri A Bauer Gy 01 New document 29 10 2013 Zs Gyim thy T Gyetvai Ver Alteration Date Des Mod Appr Figure 17 Working position of the press...

Page 22: ...ensions of the lower tool 8 2 Press out process characteristics After inserting the modules into the nest the downwards moving press fixes the PCB with the lower plate through the springs The pins are...

Page 23: ...rs Press out force Higher than 40 N pin Press out speed 2 5 mm s 8 3 Disassembling by hand If the Press fit pin head is overlapped by the PCB in such a way that the spring end is out of the PCB the di...

Page 24: ...dthrough hole good soldering Plated through holes should exhibit a vertical solder fill of 100 with a fully formed fillet on the solder side and evidence of 100 wetting on the component side lead barr...

Page 25: ...trays During the handling and assembly of the modules it is recommended to wear a conductive grounded wristlet and ensure conductive grounded working place 11 Environmental conditions The modules can...

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