flowSCREW 4w
packages
Copyright Vincotech
Handling Instruction
03
rem. sect. 5.2; mod. at sect. 5.1 29.09.2014
Gyimóthy Zs.
Gyetvai T.
FSWB-M-*-HI
Page
8 /
18
02
remove section 6.2
14.05.2014
Gyimóthy Zs.
Gyetvai T.
01
20.02.2014
Gyimóthy Zs.
Gyetvai T.
Ver.
Alteration
Date
Des. / Mod.
Appr.
Figure 7: Fingerprint on the surface
4 Heatsink specification
The heatsink's surface below the module must be plane, clean and free of particles.
Its flatness must be < 0.025 mm.
Surface roughness is to be less than Rz = 0.01 mm.
5 Thermal grease specification
The recommended means of applying paste is screen printing. Thermal resistance (R
th
)
increases if the paste is thicker than recommended. Modules are also available with phase
change material (option -/2/), whereby the R
thc-h
is guaranteed, provided that the heatsink
specification remains unchanged.
5.1 Option 1: Uniform layer of thermal paste
Apply a uniform layer of thermal conductive paste with
0.110
± 0.015 mm
thickness, fully
covered the bottom of the module.
5.2 Option 2: Module with pre-applied thermal phase change material
flow
SCREW 4w modules family is offered with pre-applied phase change material as well.
(bottom surface of the module under the active area is covered with a honeycomb pattern).
In order to receive
flow
SCREW 4w products with applied phase change material please write:
-/3/
at the end of the product ordering code.
Ordering example:
70-W212NMA600SC-M200P-/3/
