Rev. B
MultiMode SPM Instruction Manual
57
Chapter 4 Cantilever Preparation
The MultiMode microscope comes furnished with etched silicon cantilever substrates for
TappingMode AFM and silicon nitride cantilevers for Contact AFM Modes. In both cases, the
cantilever probes should be inspected under the microscope when being used for the
fi
rst time to get
a better understanding of how the probes and substrates are connected and taken apart. The
procedure for removing individual substrates from the wafer varies depending on the wafer. It will
be easier to accomplish this task with the aid of a stereo microscope having 50–70X magni
fi
cation.
The following sections are included in this chapter:
•
Silicon Cantilever Substrates:
•
Tip Shape of Etched Silicon Probes:
•
Silicon Nitride Cantilever Substrates:
•
Tip Shape of Silicon Nitride Probes:
4.1
Silicon Cantilever Substrates
The silicon cantilever substrates used in TappingMode can be removed from the wafer with the
following procedure. Note that the cantilevers are stored tip-side-up, and that the silicon is very
brittle. Contacting the cantilever during this operation will almost certainly break it off of the
substrate.
1. Inspect the wafer with an optical microscope to get a feel for the orientation of the cantilever
substrates and to inspect the cantilevers themselves. (A 10–70X stereo microscope is useful
for this task.) The cantilevers are tip side up as viewed in the wafer holder. Included with the
MultiMode microscope is a wafer tool kit which contains tweezers and wafer handling tools.
2. Disconnect the substrate from the bulk of the wafer by pressing down gently on the non-
cantilever end of the substrate. Alternatively, using the sharp pointed tweezers, carefully
break the 2 substrate supporting arms connecting the substrate to the silicon wafer frame.
The supporting arms connecting the substrate to the bulk of the wafer will shatter as pressure
is applied. See
