14
Reflow Soldering
UC-00-M30 EN R1.0
6
Reflow Soldering
In order to avoid the device falling off, the module should be placed on the top of the
main board during soldering. Reflow soldering temperature curve is recommended
as shown in figure 6-1 below (M705-GRN360 is recommended for solder paste).
Note: The module can only be soldered once.
Figure 6-1 Reflow Soldering Temperature Curve
Note: The apertures in the stencil need to meet the customer's own design
requirements and inspection specifications, and the thickness of the stencil should be
above 0.15 mm. It is recommended to be 0.18 mm.
