UC-00-M33 EN R1.0
Hardware Design
17
3.4
Grounding and Heat Dissipation
Figure 3-3 Grounding and Heat Dissipation Pad (Bottom View)
The 48 pads in the rectangle area are used for grounding and heat dissipation. In the
PCB design, the pads should be connected to a large-size ground to strengthen the heat
dissipation.
3.5
Recommended PCB Package Design
See the following figure for the recommended PCB package design.
1.
79
1.
79
2.
29
1.
09
3.
58
3.
25
1.
90
17
.00
1.
10
1.
90
3.
25
.102
2.
44
1.
19
3.
73
Figure 3-4 Recommended PCB Package Design
Notes:
For the convenience of testing, the soldering pads of the pins are designed long,
exceeding the module border much more. For example:
Grounding and
heat dissipation pad