SAM-M10Q - Integration manual
Parameter
Value
Units
Ao
16.2
mm
Bo
16.2
mm
Ko
7.0
mm
Table 18: SAM dimensions
4.2.3 Moisture sensitivity level
The moisture sensitivity level (MSL) for SAM-M10Q modules is specified in the table below.
Package
MSL level
Antenna module (professional grade)
4
Table 19: MSL level
For MSL standard see IPC/JEDEC J-STD-020, and J-STD-033 that can be downloaded from
. For more information regarding moisture sensitivity levels, labeling, storage and
drying, see the u-blox packaging information reference [
].
4.3 Soldering
Reflow soldering procedures are described in the IPC/JEDEC J-STD-020 standard.
When populating the modules, make sure that the pick and place machine is aligned to the
copper pins of the module and not to the module edge.
Soldering paste
Use of “no clean” soldering paste is highly recommended, as it does not require cleaning after the
soldering process. The paste in the example below meets these criteria.
• Soldering paste: OM338 SAC405 / Nr.143714 (Cookson Electronics)
• Alloy specification: Sn 95.5/ Ag 4/ Cu 0.5 (95.5% tin/ 4% silver/ 0.5% copper)
• Melting temperature: 217 °C
• Stencil: The exact geometry, distances, stencil thicknesses and solder paste volumes must be
adapted to the customer's specific production processes.
Reflow soldering
A convection-type soldering oven is highly recommended
over the infrared-type radiation oven.
Convection-heated ovens allow precise control of the temperature, and all parts will heat up evenly,
regardless of material properties, thickness of components and surface color.
As a reference, see “IPC-7530 Guidelines for temperature profiling for mass soldering (reflow and
wave) processes”, published in 2001.
Preheat phase
During the initial heating of component leads and balls, residual humidity will be dried out. Note that
the preheat phase does not replace prior baking procedures.
• Temperature rise rate: max 3 °C/s. If the temperature rise is too rapid in the preheat phase,
excessive slumping may be caused
• Time: 60 – 120 s. If the preheat is insufficient, rather large solder balls tend to be generated.
Conversely, if performed excessively, fine balls and large balls will be generated in clusters
• End temperature: 150 – 200 °C. If the temperature is too low, non-melting tends to be caused in
areas containing large heat capacity
Heating - reflow phase
UBX-22020019 - R01
4 Product handling
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