NINA-W1 series - User Manual
Verify the recommended maximum signal skew for differential pairs and length matching of
buses.
Minimize the routing length; longer traces will degrade signal performance. Ensure that
maximum allowable length for high speed busses is not exceeded.
Ensure that you track your impedance matched traces. Consult with your PCB manufacturer
early in the project for proper stack-up definition.
RF and digital sections should be clearly separated on the board.
Ground splitting is not allowed below the module.
Minimize bus length to reduce potential EMI issues from digital busses.
All traces (including low speed or DC traces) must couple with a reference plane (GND or power);
Hi-speed busses should be referenced to the ground plane. In this case, if the designer needs to
change the ground reference, an adequate number of GND vias must be added in the area of
transition to provide a low impedance path between the two GND layers for the return current.
Hi-Speed busses are not allowed to change reference plane. If a reference plane change is
unavoidable, some capacitors should be added in the area to provide a low impedance return path
through the different reference planes.
Trace routing should keep a distance greater than 3W from the ground plane routing edge.
Power planes should keep a distance from the PCB edge sufficient to route a ground ring around
the PCB, the ground ring must then be connected to other layers through vias.
3.6
Module footprint and paste mask
The mechanical outline of the NINA-W1 series modules can be found in the NINA-W1 series Data
Sheets.The proposed land pattern layout reflects the pads layout of the module.
The Non Solder Mask Defined (NSMD) pad type is recommended over the Solder Mask Defined
(SMD) pad type, which implements the solder mask opening 50
μ
m larger per side than the
corresponding copper pad.
The suggested paste mask layout for the NINA-W1 series modules is to follow the copper mask
layout as described in the NINA-W1 series Data Sheets.
⚠
These are recommendations only and not specifications. The exact mask geometries, distances
and stencil thicknesses must be adapted to the specific production processes of the customer.
3.7
Thermal guidelines
The NINA-W1 series modules have been successfully tested in -40 °C to +85 °C. A good grounding
should be observed for temperature relief during high ambient temperature.
3.8
ESD guidelines
The immunity of devices integrating NINA-W1 modules to Electro-Static Discharge (ESD) is part of
the Electro-Magnetic Compatibility (EMC) conformity, which is required for products bearing the CE
marking, compliant with the R&TTE Directive (99/5/EC), the EMC Directive (89/336/EEC) and the
Low Voltage Directive (73/23/EEC) issued by the Commission of the European Community.
Compliance with these directives implies conformity to the following European Norms for device
ESD immunity: ESD testing standard
CENELEC EN 61000-4-2
and the radio equipment standards
ETSI EN 301 489-1
,
ETSI EN 301 489-7
,
ETSI EN 301 489-24
, the requirements of which are
summarized in Table 2.
The ESD immunity test is performed at the enclosure port, defined by
ETSI EN 301 489-1
as the
physical boundary through which the electromagnetic field radiates. If the device implements an
integral antenna, the enclosure port is seen as all insulating and conductive surfaces housing the
