TOBY-L2 and MPCI-L2 series - System Integration Manual
UBX-13004618 - R07
Advance Information
Design-in
Page 100 of 158
Guidelines for single SIM chip connection
A solderable SIM chip (M2M UICC Form Factor) must be connected the SIM card interface of TOBY-L2 and
MPCI-L2 series modules as described in Figure 50.
Follow these guidelines to connect the module to a solderable SIM chip without SIM presence detection:
Connect the UICC / SIM contacts C1 (VCC) and C6 (VPP) to the
VSIM
/
UIM_PWR
pin of the module.
Connect the UICC / SIM contact C7 (I/O) to the
SIM_IO
/
UIM_DATA
pin of the module.
Connect the UICC / SIM contact C3 (CLK) to the
SIM_CLK
/
UIM_CLK
pin of the module.
Connect the UICC / SIM contact C2 (RST) to the
SIM_RST
/
UIM_RESET
pin of the module.
Connect the UICC / SIM contact C5 (GND) to ground.
Provide a 100 nF bypass capacitor (e.g. Murata GRM155R71C104K) at the SIM supply line close to the
relative pad of the SIM chip, to prevent digital noise.
Provide a bypass capacitor of about 22 pF to 47 pF (e.g. Murata GRM1555C1H470J) on each SIM line, to
prevent RF coupling especially in case the RF antenna is placed closer than 10 - 30 cm from the SIM lines.
Limit capacitance and series resistance on each SIM signal to match the SIM requirements (27.7 ns is the
maximum allowed rise time on clock line, 1.0 µs is the maximum allowed rise time on data and reset lines).
TOBY-L2 series
59
VSIM
57
SIM_IO
56
SIM_CLK
58
SIM_RST
SIM CHIP
SIM Chip
Bottom View
(contacts side)
C1
VPP (C6)
VCC (C1)
IO (C7)
CLK (C3)
RST (C2)
GND (C5)
C2 C3
C5
U1
C4
2
8
3
6
7
1
C1
C5
C2
C6
C3
C7
C4
C8
8
7
6
5
1
2
3
4
MPCI-L2 series
8
UIM_PWR
10
UIM_DATA
12
UIM_CLK
14
UIM_RESET
SIM CHIP
SIM Chip
Bottom View
(contacts side)
C1
VPP (C6)
VCC (C1)
IO (C7)
CLK (C3)
RST (C2)
GND (C5)
C2 C3
C5
U1
C4
2
8
3
6
7
1
C1
C5
C2
C6
C3
C7
C4
C8
8
7
6
5
1
2
3
4
Figure 50: Application circuits for the connection to a single solderable SIM chip, with SIM detection not implemented
Reference
Description
Part Number - Manufacturer
C1, C2, C3, C4
47 pF Capacitor Ceramic C0G 0402 5% 50 V
GRM1555C1H470JA01 - Murata
C5
100 nF Capacitor Ceramic X7R 0402 10% 16 V
GRM155R71C104KA01 - Murata
U1
SIM chip (M2M UICC Form Factor)
Various Manufacturers
Table 30: Example of components for the connection to a single solderable SIM chip, with SIM detection not implemented
