MAX-7 / NEO-7 - Hardware Integration Manual
UBX-13003704
-
R09
Production Information
Design
Page
19 of 52
3.3
Layout
This section provides important information for designing a robust GNSS system.
GNSS signals at the surface of the Earth are about 15 dB below the thermal noise floor. Signal loss from the
antenna to RF_IN pin of the module must be minimized as much as possible. When defining a GNSS receiver
layout, the placement of the antenna with respect to the receiver, as well as grounding, shielding and jamming
from other digital devices, are crucial issues requiring careful consideration.
For all layout and routing figures shown in this section, see the data sheet for exact pin orientation.
3.3.1
Footprint and paste mask
Figure 7 through Figure 10 describe the footprint and provide recommendations for the paste mask for u-blox 7
LCC modules. These are recommendations only and not specifications. Note that the Copper and Solder masks
have the same size and position.
To improve the wetting of the half vias, reduce the amount of solder paste under the module and increase the
volume outside of the module by defining the dimensions of the paste mask to form a T-shape (or equivalent)
extending beyond the Copper mask.
12.2 mm [480.3 mil]
1
6
.0
m
m
[63
0
mi
l]
1.0 mm
[39.3 mil]
0
.8
m
m
[3
1
.5
mi
l]
0.8 mm
[31.5 mil]
3
.0
m
m
[1
1
8
.1
mi
l]
1
.0
m
m
[3
9
.3
mi
l]
1
.1
m
m
[4
3
.3
mi
l]
Figure 7: NEO-7 footprint
9.7 mm [382 mil]
10
.1
m
m
[3
9
8
m
il]
1.0 mm
[39.3 mil]
0
.7
m
m
[2
7
.6
m
il]
0.8 mm
[31.5 mil]
0
.6
5
m
m
[2
6
.6
m
il]
1
.1
m
m
[4
3
.3
m
il]
0
.8
m
m
[3
1
.5
m
il]
Figure 8: MAX-7 footprint
Stencil: 150
m
10.4 mm [409.5 mil]
14.6 mm [575 mil]
12.2 mm [480 mil]
0
.8
m
m
[3
1
.5
m
il]
0
.6
m
m
[2
3
.5
m
il]
Figure 9: NEO-7 paste mask
Stencil: 150
m
7.9 mm [311 mil]
12.5 mm [492 mil]
9.7 mm [382 mil]
0.
7
m
m
[2
7.
6
m
il]
0.
5
m
m
[1
9.
7
m
il]
0.
8
m
m
[3
1.
5
m
il]
0.
6
m
m
[2
3.
5
m
il]
Figure 10: MAX-7 paste mask
MAX Form Factor (10.1 x 9.7 x 2.5): Same Pitch as NEO for all pins: 1.1 mm, but 4 pads in each corner
(pin 1, 9, 10 and 18) only 0.7 mm wide instead 0.8 mm
Consider the paste mask outline when defining the minimal distance to the next component. The exact
geometry, distances, stencil thicknesses and solder paste volumes must be adapted to the specific
production processes (e.g. soldering) of the customer.
