NINA-B1 series - System Integration Manual
UBX-15026175 - R06
Appendix
Page 46 of 48
Item
Value
S
W
280 µm
T
Soldermask: 20 +/- 10 µm
Copper film and plating/surface coating: 35 +/- 15 µm
H
150 +/- 20 µm
ε
r
3.77 +/- 0.5
Table 14: Coplanar micro-strip specification
Figure 19 displays the minimum required GND trace required around the RF trace and pins. GND stitching vias
should be used around the RF trace to ensure a proper GND connection. No other components are allowed
within this area.
The solid GND layer beneath the ‘top layer’ shall surround at least the entire RF trace and connector. No signal
traces are allowed to be routed on the GND layer within this area but vias and small openings are allowed.
Figure 19: RF trace and minimum required GND trace of the NINA-B111 external antenna reference design
